Touch Display TCON and TIC Shared Non-Volatile Memory
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Solution Overview
Problem
Existing electronic devices face challenges in integrating a non-volatile memory with a timing controller (TCON) and a touch integrated circuit (TIC) due to the need for specific technologies to integrate flash memory into the TIC, leading to high costs and limited independence in preparation.
Innovation Solution
The TCON and TIC share a non-volatile memory disposed outside the TIC, allowing for time-sharing access through an arbitration controller or enable control line, eliminating the need for flash memory integration within the TIC and reducing preparation costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flash memory is integrated into the TIC, then the TIC can store non-volatile data, but the preparation cost increases and independence is limited
Solution Approach 1:
The non-volatile memory is designed to serve dual purposes: it provides storage for the TCON (timing controller) and simultaneously provides storage for the TIC (touch integrated circuit). This multi-functional design eliminates the need for separate flash memory in the TIC, reducing preparation costs while maintaining non-volatile storage capability for both components.
Solution Approach 2:
An arbitration controller is introduced as an intermediary component to manage access between the TCON and TIC to the shared non-volatile memory. The arbitration controller allocates access rights and coordinates data transmission, enabling both the TCON and TIC to utilize the same memory resource without conflict, thus achieving cost reduction while preserving functional independence.
2Adaptability or versatility
If a separate non-volatile memory is allocated for each of TCON and TIC, then each can operate independently, but the device complexity and cost increase
Solution Approach 1:
The patent merges the non-volatile memory resources for the TCON and TIC into a single shared memory unit. By combining what would traditionally be separate memory components into one unified resource, the system reduces overall complexity and component count while maintaining the ability for both controllers to operate independently through arbitration management.
Solution Approach 2:
The shared non-volatile memory is designed with universal access capability, allowing it to serve both the TCON and TIC simultaneously. This multi-functional memory structure eliminates the need for duplicate memory units while preserving the independent operational requirements of each controller through coordinated access management.
3Ease of manufacture
If the non-volatile memory is shared between TCON and TIC, then preparation costs are reduced, but access coordination is required
Solution Approach 1:
The arbitration controller serves as a mediator between the TCON and TIC, managing their access to the shared non-volatile memory. This intermediary component handles the complexity of access coordination, allowing the memory to be shared without requiring complex direct negotiation between the TCON and TIC, thus reducing preparation costs while maintaining organized access control.
Solution Approach 2:
The arbitration controller implements a feedback mechanism to monitor and manage access requests from both the TCON and TIC. By continuously monitoring the state of the shared memory and dynamically allocating access rights based on current needs, the system efficiently manages the shared resource without requiring overly complex access protocols, balancing cost reduction with controlled complexity.
Data Source
AI summary
An electronic device includes a touch display panel having touch and display functions. The electronic device further includes a TCON and a TIC. The TCON is configured to provide a timing control signal for the touch display panel, and the TIC is configured to provide a touch signal for the touch display panel. The electronic device further includes a circuit board and the non-volatile memory. The circuit board is coupled to the touch display panel, and the TIC is disposed on the circuit board.


