Touch Display Panel Stepped Encapsulation for Chip Integration
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Solution Overview
Problem
In external touch display devices, the need for separate chips to control touch and display functions results in a large number of chips being used, making it structurally difficult to directly connect these functions.
Innovation Solution
A touch display panel design where the touch function layer is electrically connected to the array substrate along a stepped structure on the edge of the encapsulation layer, allowing a single chip to integrate both display and touch control functions, reducing the number of chips required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate chips are used to control touch and display functions, then each function can be independently controlled, but the number of chips increases making the structure complex
Solution Approach 1:
The patent merges the touch control function and display control function into a single integrated control chip. The control chip includes both a touch control module and a display control module, allowing both functions to be controlled by one chip rather than requiring separate chips, thus reducing device complexity while maintaining independent control capability through software module separation.
Solution Approach 2:
The control chip is designed with multi-functionality, incorporating both touch control and display control capabilities in a single universal chip. This universal chip can handle multiple functions (touch sensing, touch processing, display driving) that traditionally required separate dedicated chips, thereby reducing the overall number of components while preserving functional independence through modular software architecture.
2Device complexity
If the touch function layer is directly connected to the array substrate, then the number of chips is reduced, but the steep gradient between layers creates manufacturing difficulty
Solution Approach 1:
The patent introduces a stepped structure that adds a dimensional feature to the encapsulation layer edge. Instead of a simple vertical connection, the encapsulation layer forms steps with different height levels that create intermediate connection points, allowing the touch function layer to connect to the array substrate in a manner that accommodates the height difference and reduces manufacturing difficulty.
Solution Approach 2:
The stepped structure of the encapsulation layer acts as an intermediary element between the touch function layer and the array substrate. The steps provide intermediate connection levels that facilitate the tracing connection, serving as a mediator that bridges the height gap and makes the direct connection structurally feasible without requiring additional complex components.
3Ease of manufacture
If a stepped structure is formed at the encapsulation layer edge, then the gradient is alleviated facilitating connection, but the manufacturing process becomes more complex
Solution Approach 1:
The encapsulation layer is segmented into multiple stepped levels rather than forming a single continuous layer. This segmentation creates discrete height levels that are easier to manufacture individually using standard coating processes, with each step forming a distinct layer that can be controlled separately, thereby reducing the overall manufacturing precision requirements compared to forming a single complex gradient structure.
Data Source
AI summary
A touch display panel and a touch display device including an array substrate, a light-emitting layer, an encapsulation layer, and a touch function layer are provided. The array substrate includes a first trace. The touch function layer includes a second trace. The second trace is electrically connected to the chip by a bonding end, in which the chip is integrated with functions of display control and touching control. This realizes a control of a display function and a touch function of the touch display panel or the touch display device, thereby reducing the number of chips. At the same time, the stepped structure of the edge of the encapsulation layer effectively alleviates the steep gradient between the touch function layer and the array substrate, thereby facilitating the electrical connection of the trace on the touch function layer to the trace on the array substrate.