Touch Display Substrate Wire Layer Crosstalk Reduction

The wire layer is segmented into multiple sub-layers (first wire layer and second wire layer) with different wiring patterns. Wires connecting to odd-row common electrodes are placed in the first wire layer, while wires connecting to even-row common electrodes are placed in the second wire layer. This segmentation prevents overlapping between wires and common electrodes, eliminating vertical crosstalk while maintaining a relatively simple control circuit structure.

The patent transitions from a single-plane wire arrangement to a multi-layer three-dimensional arrangement. By stacking wire layers at different heights above the substrate, the design allows wires to connect to common electrodes without overlapping in the vertical dimension, thus avoiding parasitic capacitance coupling and vertical crosstalk while preserving routing simplicity.

The wiring structure is segmented into multiple layers with distinct functions. The first wire layer handles connections to odd-row electrodes, while the second wire layer handles even-row electrodes. This segmentation allows each layer to have a simpler, more regular wiring pattern, reducing overall complexity compared to attempting to route all wires in a single layer while avoiding overlaps.

The patent uses a repetitive, modular wiring pattern where the same basic wire configuration is copied alternately for odd and even rows, just placed in different layers. This regularity and repetition simplify the wiring design process and manufacturing, offsetting the added complexity of multiple layers through standardization.

The patent resolves the conflict between structural simplicity and crosstalk prevention by adding a vertical dimension with multiple wire layers. This allows wires to connect to common electrodes without striding over them in the same plane, eliminating parasitic capacitance and vertical crosstalk while maintaining a relatively organized and systematic wire layer structure.

The patent introduces an intermediary insulating layer between the wire layers and the common electrode layer, and between different wire layers. This intermediary structure enables wires to pass over or near common electrodes without direct electrical coupling, preventing crosstalk while allowing the wire layers to maintain their routing simplicity.