Touch Electrode Layer Stacking With Exposed Conductive Coupling
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Solution Overview
Problem
Manufacturing electronic display devices, particularly those with touch screens, is complex due to the need for multiple layers of electrode patterns, which increases processing steps and device thickness.
Innovation Solution
A method of manufacturing electronic devices that allows for easier coupling of conductive patterns at different levels by using a first conductive layer with projections and an insulating layer to expose a second conductive layer, reducing the need for etching and contact hole formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple layers of electrode patterns are used to achieve touch screen functionality, then the device can sense touch events and display information, but the processing steps become more complex and the device thickness increases
Solution Approach 1:
The patent combines multiple electrode patterns and conductive layers into a single integrated structure. The first and second conductive layers are formed in a sequential process where the second layer is deposited over the first layer with selective exposure, merging what would traditionally be separate fabrication steps into one unified manufacturing process. This reduces the overall complexity while maintaining the multi-layer electrode functionality needed for touch screen operation.
2Adaptability or versatility
If multiple layers of electrode patterns are used to achieve touch screen functionality, then the device can sense touch events and display information, but the device thickness increases
Solution Approach 1:
The patent utilizes vertical stacking of conductive layers in the thickness dimension to achieve multi-layer electrode functionality without increasing the planar footprint. By forming the first conductive layer, then depositing an insulating layer with selective exposure, and finally forming the second conductive layer in the same vertical stack, the design achieves complex electrode patterns while maintaining a compact thickness profile through precise vertical positioning of each layer.
3Reliability
If conventional manufacturing methods with etching and contact hole formation are used, then conductive patterns at different levels can be connected, but the number of manufacturing process steps increases
Solution Approach 1:
The patent performs preliminary action by forming the first conductive layer with specific patterns before depositing the insulating layer. The insulating layer is then deposited with selective exposure that pre-determines where the second conductive layer will be exposed and connected to the first layer. This preliminary structuring eliminates the need for subsequent etching and contact hole formation steps, as the connection paths are already established through the selective exposure design in the insulating layer.
Data Source
AI summary
An electronic device including a base structure, a first pattern having at least one projection disposed on the base structure, a first conductive layer including a first portion disposed on the base structure and a second portion disposed on the first pattern and connected to the first portion, an insulating layer disposed on the first conductive layer covering the first portion and exposing the second portion, and a second conductive layer provided on the insulating layer and overlapping the first conductive layer. The second conductive layer is spaced apart from the first portion and is in contact with the second portion. Methods of manufacturing an electronic device capable of reducing the number of process steps in the manufacturing process are also disclosed.