Capacitive Touch Housing Patterning for Curved Surface Adhesion

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Solution Overview

Problem

Conventional methods for forming capacitive touch sensitive housings on curved and bent surfaces are time-consuming, power-intensive, and prone to damaging insulating substrates due to the large area removal of metal layers by laser ablation, resulting in low adherence of circuit patterns.

Innovation Solution

A method involving forming a non-patterned active metal layer on a housing wall, patterning it using laser ablation to create separated plating and non-plating portions, and then depositing a metal layer on these portions, with electroplating and electroless deposition techniques to form a layered structure for capacitive touch sensor units.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If laser ablation is used to pattern metal layers on curved surfaces, then circuit patterns can be formed, but the process becomes time-consuming and power-intensive

Engineering Contradiction:
Improvecircuit pattern formation capabilityVSAvoidprocessing time
Core Design Contradiction:
Ease of manufactureVSLoss of time

Solution Approach 1:

The patent applies preliminary action by first forming a complete metal layer across the entire curved surface before laser patterning. This preliminary metal layer formation simplifies the subsequent patterning process by providing a uniform base material that can be selectively removed, rather than attempting to build up complex patterns directly on curved surfaces.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent segments the metal layer formation process into distinct stages: first forming the complete metal layer, then selectively removing portions through laser ablation. This segmentation allows each stage to be optimized independently, reducing overall processing time and power consumption.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If large area of metal layer is removed by laser ablation, then circuit patterns are formed, but power consumption increases and insulating substrates are damaged

Engineering Contradiction:
Improvecircuit pattern formationVSAvoidlaser power consumption
Core Design Contradiction:
Ease of manufactureVSUse of energy by moving object

Solution Approach 1:

The patent applies the extraction principle by removing only the necessary portions of the metal layer through laser ablation after the complete layer is formed. This approach minimizes the total laser energy required compared to attempting to deposit metal only in the final pattern shape, as it involves removing material rather than adding it in a complex curved geometry.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent converts the potential harm of laser ablation (substrate damage from excessive energy) into a benefit by using controlled, minimal ablation. The preliminary complete metal layer formation allows for precise, low-energy removal of only necessary portions, transforming the ablative process from a high-damage operation to a precise patterning tool.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Ease of manufacture

If conventional electroless plating is used to form conductive lines, then circuits can be formed on insulating substrates, but adherence is relatively low

Engineering Contradiction:
Improvecircuit formation capabilityVSAvoidadherence to substrate
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The patent applies composite materials by combining multiple metal layers with different properties. The preliminary metal layer provides strong adhesion to the insulating substrate, while subsequent selectively removed portions create the circuit pattern. This layered composite structure ensures both strong adherence and precise pattern formation.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent uses preliminary action by forming the complete metal layer that serves as both the adhesive base layer and the source material for patterning. This preliminary layer is specifically optimized for substrate adherence, and the circuit pattern is derived from it through selective removal, ensuring strong bonding throughout the process.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces time and power consumption while enhancing the adherence of circuit patterns on insulating substrates, enabling efficient and durable capacitive touch sensitive housing formation on complex surfaces.

Implementation Method 1

the active metal layer being made from an active material containing an active metal that is capable of catalytically initiating the forming of the metal layer

Methodology Applied
Scientific EffectElectroless deposition:

Implementation Method 2

patterning the non-patterned active metal layer on the housing wall by laser ablation

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 3

with electroplating and electroless deposition techniques to form a layered structure

Methodology Applied
Scientific EffectElectroplating: Electroplating

Data Source

PatentUS9678532B2Capacitive touch sensitive housing and method for making the same
Publication Date: 2017.06.13 TAIWAN GREEN POINT ENTERPRISE
  • US9678532B2 patent drawing
  • US9678532B2 patent drawing
  • US9678532B2 patent drawing

AI summary

A method for making a capacitive touch sensitive housing, comprises: forming a non-patterned active metal layer on a housing wall; patterning the non-patterned active metal layer on the housing wall by laser ablation such that the non-patterned active metal layer is formed into a patterned active metal layer including a plurality of plating portions separated from each other, and a plurality of non-plating portions separated from the plating portions; and forming a metal layer on the patterned active metal layer such that the metal layer has first portions formed on the plating portions of the patterned active metal layer, and second portions formed on the non-plating portions of the patterned active metal layer.