Touch Lead Density Variation for Display Panel Testing
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Solution Overview
Problem
The conventional manufacturing method of integrated touch display panels faces alignment accuracy issues due to the dense spacing of touch leads in the non-display sub-region, making it impossible to perform connection tests without bonding a chip (IC).
Innovation Solution
The display panel design includes extending touch leads from the non-display sub-region to a cutting region with a lower density of touch leads, allowing for accurate alignment and testing with an external test circuit, and subsequent removal of the cutting region for production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If touch leads are integrated on the non-display sub-region, then the spacing between touch leads becomes small, but alignment accuracy for connection testing deteriorates
Solution Approach 1:
The patent divides the touch lead arrangement into two distinct regions: the non-display sub-region for integration and the cutting region for testing. This segmentation allows the touch leads to be densely packed in the non-display sub-region while being sparsely arranged in the cutting region, enabling alignment accuracy for connection testing without compromising integration density
Solution Approach 2:
The patent extends the touch leads from the non-display sub-region into the cutting region, utilizing the spatial dimension of the cutting region to create a testable interface. This dimensional extension transforms the testing problem from a 2D alignment issue to a 3D spatial solution where leads can be accessed at a different location with better alignment characteristics
2Device complexity
If touch leads are densely spaced in the non-display sub-region, then integration is achieved, but connection testing without IC bonding becomes impossible
Solution Approach 1:
The patent extracts the testing function from the non-display sub-region by extending touch leads into the cutting region. This extraction creates a separate testing interface that is spatially separated from the integration area, allowing connection testing to be performed on the extended leads in the cutting region where spacing is sufficient for test probe access
Solution Approach 2:
The cutting region acts as an intermediary zone between the integrated touch leads in the non-display sub-region and the external testing equipment. The extended touch leads in the cutting region serve as mediators that maintain electrical connection to the densely packed leads while providing accessible test points for connection testing without IC bonding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient testing of touch electrodes before IC bonding, improving detection efficiency and utilizing the cutting region effectively, while allowing for seamless integration into subsequent manufacturing processes.
Implementation Method 1
organic light-emitting layer disposed on a side of the thin film transistor layer away from the flexible substrate and corresponding to the display sub-region
Data Source
AI summary
A display panel and a testing method thereof, the display panel including a product region and a cutting region, and the product region including a display sub-region and a non-display sub-region. The display panel includes a flexible substrate, a thin film transistor layer, an organic light-emitting layer, a encapsulation layer, and a touch layer. The touch layer includes touch electrodes and touch leads. An end of each of the touch leads is connected to a corresponding touch electrode, the other end of each of the touch leads extends from the non-display sub-region to the cutting region, and a density of the touch leads in the cutting region is less than a density of the touch leads in the non-display sub-region.