Touch Line Capping Pattern for Delamination-Resistant Displays
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Solution Overview
Problem
The manufacturing process of display devices often results in defects such as delamination of layers due to leakage of organic material along inclined surfaces during the etching process for forming touch lines, primarily caused by insufficient photoresist thickness.
Innovation Solution
A display device design that includes a substrate with a specific thickness pattern in the peripheral area, featuring a first section with a thicker part, a thinner part, and an intermediate inclined part, where a thickening pattern is formed to overlap the inclined part, preventing leakage and delamination by ensuring adequate photoresist coverage during the etching process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photoresist is deposited on inclined surfaces during etching process, then touch lines can be formed, but insufficient photoresist thickness causes leakage of organic material and layer delamination
Solution Approach 1:
A bank structure is formed beforehand on the substrate before depositing the photoresist layer. This bank provides a physical support that maintains adequate photoresist thickness on inclined surfaces during subsequent etching processes, preventing organic material leakage and layer delamination.
Solution Approach 2:
The bank acts as an intermediary structure between the substrate and the photoresist layer. It provides mechanical support to the photoresist on inclined surfaces, ensuring sufficient thickness coverage without requiring changes to the photoresist deposition process itself.
2Ease of manufacture
If layers are deposited along inclined surfaces, then structural components can be formed, but non-uniform layer thickness results
Solution Approach 1:
The bank structure is prepared in advance before subsequent layer depositions. This pre-formed structure provides a stable foundation that ensures uniform layer thickness when materials are deposited on inclined surfaces, eliminating the need for complex real-time thickness control during deposition.
Solution Approach 2:
The bank structure modifies the geometric parameters of the substrate surface, creating controlled inclined regions with specific angles and heights. This allows subsequent layers to be deposited with improved thickness uniformity by changing the surface geometry rather than changing the deposition process parameters.
3Reliability
If photoresist thickness is increased to prevent leakage, then delamination is reduced, but manufacturing complexity increases
Solution Approach 1:
Rather than increasing photoresist thickness directly, a bank structure is introduced as an intermediary to maintain adequate photoresist thickness on inclined surfaces. This approach prevents leakage without requiring uniform increases in photoresist thickness across the entire substrate, thereby avoiding excessive manufacturing complexity.
Solution Approach 2:
The bank structure is selectively formed only in regions where inclined surfaces require support, rather than uniformly across the entire substrate. This localized approach maintains photoresist thickness where needed while keeping the overall device structure and manufacturing process relatively simple.
Data Source
AI summary
A display device including a substrate having a display area and a peripheral area defined outside the display area, a circuit layer disposed on the substrate, a device layer disposed on the display area, an encapsulation layer covering the device layer, a touch sensing unit including at least one touch insulating layer disposed on the encapsulation layer, touch electrodes disposed on the encapsulation layer, and touch signal lines connected to the touch electrodes, a first section disposed in the peripheral area and including a first part having a first thickness, a second part having a second thickness less than the first thickness and overlapping the touch signal lines, and an intermediate part connecting the first part and the second part and being inclined, and a first thickening pattern overlapping at least the intermediate part.