Touch Electrode Mesh Layout to Protect Pixel Openings
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Solution Overview
Problem
Existing touch structures in display panels face issues with metal lines obstructing pixel openings, leading to display defects like cross-color and reduced pixel aperture ratio, especially when sub-pixels with close intervals are involved.
Innovation Solution
The solution involves arranging metal meshes outside pixel opening regions and sharing mesh holes between adjacent sub-pixels with smaller intervals, ensuring metal lines are sufficiently distant from pixel openings, thereby preventing display interference and optimizing manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal lines are arranged to connect touch electrodes, then touch functionality is achieved, but metal lines obstruct pixel openings causing display defects and reduced aperture ratio
Solution Approach 1:
The patent transitions from planar metal line connections to three-dimensional via hole connections, routing touch electrode signals vertically through the substrate thickness rather than horizontally across the pixel plane. This dimensional change allows metal connections to pass through pixel openings without obstructing light, resolving the conflict between touch functionality and display quality.
Solution Approach 2:
The patent embeds via holes containing metal lines within the substrate structure, nesting the connection function inside the substrate volume rather than placing it on the surface. This nesting approach allows metal connections to occupy space within the substrate thickness, clearing the pixel opening area for optimal light transmission while maintaining electrical connectivity.
2Measurement precision
If metal lines are placed close to pixel openings to improve touch sensitivity, then touch detection capability increases, but display quality deteriorates due to cross-color and interference
Solution Approach 1:
The patent moves metal connections from the two-dimensional pixel plane to the third dimension by creating via holes that extend vertically through the substrate. This allows touch electrodes to be positioned close to pixel openings for high sensitivity while metal lines route through the substrate depth, preventing optical interference and cross-color effects.
3Ease of manufacture
If conventional metal line routing is used for touch electrodes, then manufacturing process is simple, but pixel aperture ratio is reduced and display quality suffers
Solution Approach 1:
The patent incorporates via holes with metal linings as integral parts of the substrate structure, nesting the connection function within the substrate volume. This approach maintains manufacturing simplicity by using standard semiconductor fabrication processes while dramatically improving pixel aperture ratio by eliminating surface-level metal obstructions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances display quality by minimizing display defects while reducing manufacturing complexity and cost, leveraging the flexibility of metal meshes for improved touch sensitivity and resolution.
Implementation Method 1
it has been attempted to use a sputtering method for depositing the transparent conductive film layer
Data Source
Figure 1A
Figure 1B
Figure 1C~1D
AI summary
A touch structure, a touch display panel and an electronic device are provided. The touch structure includes a first metal mesh layer and a second metal mesh layer, the first metal mesh layer includes a first touch electrode and second touch sub-electrodes, the second metal mesh layer includes second connection electrodes spaced apart from each other, and each of the second connection electrodes is electrically connected with an adjacent second touch sub-electrode through via holes in the insulation layer. At least two first metal meshes of the second touch sub-electrodes include multiple vertices overlapping with at least two second metal meshes of the second connection electrodes, the multiple vertices include connection vertices, and the via holes are respectively disposed at the connection vertices; at most one of vertices adjacent to each connection vertex is a connection vertex. The touch structure can effectively reduce capacitance load on the touch electrodes.