Touch Module Conductive Adhesive Layer Design
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Solution Overview
Problem
Conventional touch modules are vulnerable to environmental factors due to exposed regions of the bond pad not covered by conductive adhesive, leading to abnormal electrical properties and appearance issues, which affect touch performance and yield rate.
Innovation Solution
A touch module design featuring a touch panel unit with a protection layer covering part of the signal transmitting structure, a conductive adhesive layer that extends to cover the protection layer, and a circuit board positioned on the conductive adhesive layer, ensuring comprehensive protection and electrical connectivity without overlapping with the protection layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive adhesive is applied only to the region not covered by protection layer, then electrical connectivity is achieved, but exposed regions of bond pad remain vulnerable to environmental factors
Solution Approach 1:
The conductive adhesive layer is divided into two functional portions: a main portion that provides electrical connectivity and a cover portion that extends to cover the protection layer. This segmentation allows each portion to fulfill its specific function while working together to solve the contradiction between electrical connectivity and environmental protection.
Solution Approach 2:
The conductive adhesive layer is designed to extend in advance beyond the boundary of the protection layer during the manufacturing process. This preliminary extension ensures that the cover portion is already in position to provide protection before the module is subjected to environmental factors during use.
2Object-affected harmful factors
If conductive adhesive covers the entire bond pad surface, then comprehensive protection is achieved, but manufacturing complexity increases due to alignment requirements
Solution Approach 1:
The conductive adhesive layer has different properties in different regions: the main portion provides electrical conductivity for connectivity, while the cover portion provides protective coverage. This local differentiation allows comprehensive protection without requiring the entire adhesive layer to have uniform properties, simplifying manufacturing alignment requirements.
Solution Approach 2:
The conductive adhesive layer serves multiple functions simultaneously: it provides electrical connectivity through the main portion and environmental protection through the cover portion. This multi-functionality eliminates the need for separate protective layers or additional dispensing processes, reducing manufacturing complexity.
3Object-affected harmful factors
If additional dispensing process is used to protect exposed bond pad regions, then comprehensive protection is achieved, but manufacturing time and cost increase
Solution Approach 1:
The protective function and electrical connectivity function are merged into a single conductive adhesive layer structure. The cover portion of the conductive adhesive layer performs the protective function that would otherwise require a separate dispensing process, while the main portion maintains electrical connectivity. This merging eliminates additional manufacturing steps.
Solution Approach 2:
The conductive adhesive layer is designed to perform multiple functions: electrical connectivity through the main portion and environmental protection through the cover portion. This multi-functionality replaces the need for separate protective dispensing processes, improving manufacturing productivity and yield rate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides comprehensive protection to the signal transmitting structure, preventing abnormal electrical properties and appearance issues, improving manufacturing yield rate by eliminating the need for additional dispensing processes and reducing costs.
Implementation Method 1
The conductive adhesive layer includes a main portion which covers a region of the signal transmitting structure that is exposed from the protection layer and a cover portion which extends from the main portion to cover the protection layer
Implementation Method 2
By way of the pressing of the circuit board, the conductive adhesive layer flows toward the protection layer so that the conductive adhesive layer is formed into a main portion that covers a portion of the signal transmitting structure on which the protection layer is not disposed, and a cover portion that extends from the main portion to the protection layer and covers the protection layer
Data Source
AI summary
A touch module includes a touch panel unit, a conductive adhesive layer and a circuit board. The touch panel unit includes a substrate, a touch sensing structure disposed on the substrate, a signal transmitting structure disposed on the substrate and electrically connected to the touch sensing structure, and a protection layer covering a part of a surface of the signal transmitting structure. The protection layer and the substrate are disposed at two opposite sides of the signal transmitting structure. The conductive adhesive layer has a main portion which covers a region of the signal transmitting structure on which the protection layer is not disposed, and a cover portion which extends from the main portion and covers the protection layer. The circuit board is disposed on the conductive adhesive layer, and the circuit board and the signal transmitting structure are disposed at two opposite sides of the conductive adhesive layer.