Touch Module Bridging Pattern Layer RC Reduction
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Solution Overview
Problem
Traditional One Glass Solution (OGS) touch panels with indium tin oxide (ITO) electrodes face challenges in reducing the RC value effectively, leading to unsatisfactory refresh rates, especially when scaling from small to large sizes, and are prone to cracks due to height differences in the electrode layer, which complicates the transfer of spatially irregular thickness adjustments to a flat glass surface.
Innovation Solution
A touch module design featuring a substrate with a bridging pattern layer, a first insulating layer with three insulating blocks having slopes, and an electrode pattern layer composed of sequentially stacked transparent oxide conductive layers and a metal layer, which reduces resistance values and mitigates cracking issues through improved adhesion and film formation, along with the inclusion of a copper oxide layer for enhanced visual effects and the use of drain trenches to prevent over-corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional OGS touch panels use ITO electrodes, then the structure is simple, but the RC value cannot be effectively reduced, leading to unsatisfactory refresh rates
Solution Approach 1:
The patent employs a composite electrode structure consisting of multiple layers including transparent conductive layers (ITO, IZO, IFO) and metal layers (Al, Mo, Cu) stacked in sequence. This composite material approach reduces the overall RC value by combining materials with different electrical and optical properties, achieving both low resistance and high transparency while maintaining structural simplicity.
2Ease of manufacture
If composite electrode layers are formed on one side of glass (OGS-SITO structure), then manufacturing cost is reduced, but cracks occur in the electrode pattern layer where it climbs the bridging pattern layer
Solution Approach 1:
The patent introduces thickness adjustment portions that create controlled height differences in the electrode pattern layer. By adding vertical dimension variations through additional insulating blocks or adjusting existing block heights, the structure accommodates the electrode layer's transition over bridging pattern layers, preventing cracks while maintaining the cost-effective single-side fabrication approach.
Solution Approach 2:
The patent incorporates additional insulating blocks or thickness adjustment portions beforehand to create buffer zones that cushion the stress during electrode layer formation. These pre-positioned structural elements prevent crack propagation by providing stress relief zones where the electrode layer transitions over bridging pattern layers.
3Reliability
If spatially irregular thickness adjustment portions are designed for OGS-SITO architecture, then crack issues are addressed, but the design is difficult to transfer to the flat formation surface of glass
Solution Approach 1:
The patent applies thickness adjustment portions selectively at specific locations where bridging pattern layers are present, rather than uniformly across the entire glass surface. This localized approach addresses crack prevention needs only where required, maintaining the overall flat formation surface for ease of manufacturing while providing targeted stress relief at critical transition zones.
4Illumination intensity
If the electrode pattern layer is made transparent to maintain light transmittance, then visibility is improved, but resistance value increases
Solution Approach 1:
The patent uses a multi-layer composite electrode structure with alternating transparent conductive layers (ITO, IZO, IFO) and metal layers (Al, Mo, Cu). The transparent layers maintain high light transmittance while the metal layers provide low resistance pathways, achieving a balance between optical performance and electrical conductivity through material composition optimization.
Data Source
AI summary
A touch module includes a substrate, a bridging pattern layer, first and second insulating layers, and an electrode pattern layer. The bridging pattern layer, disposed on the substrate, includes a bridging electrode. The first insulating layer, disposed on the bridging pattern layer, includes first and second insulating blocks respectively formed at opposite ends of the bridging electrode and a third insulating block separately located between the first and second insulating blocks by two exposed regions of the first insulating layer. The electrode pattern layer, disposed on the first insulating layer, is electrically connected to the bridging electrode through the two exposed regions. The electrode pattern layer includes first and second transparent conductive layers and a metal layer and has two through hole regions directly above the bridging electrode. The second insulating layer, disposed on the electrode pattern layer, covers and fills the two through hole regions.