Integrated Mold Assembly for Touch Module Positioning
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Solution Overview
Problem
Conventional touch module assembly using independent mold assemblies leads to assembly deviations due to relative position deviations during assembly, making it difficult to determine and correct the source of these deviations.
Innovation Solution
A mold assembly comprising a base with a concave for the carrier, a first frame for the circuit board, and a second frame for the touch film, which are detachably assembled to guide the assembly of the touch module and facilitate its installation into a housing using positioning and securing elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple independent mold assemblies are used to assemble the touch module, then the assembly process can be divided into separate steps for different components, but relative position deviations occur during assembly and assembly accuracy deteriorates
Solution Approach 1:
The patent merges multiple independent mold assemblies into a single integrated mold assembly that includes a first mold for the circuit board, a second mold for the touch film, and a third mold for the carrier all connected to a common base. This integration ensures that all components are assembled simultaneously with fixed relative positions, eliminating position deviations that occur when using separate independent mold assemblies while still allowing distinct assembly steps for different components
2Measurement precision
If a positioning column and positioning hole are used to install the touch module in the housing, then the touch module can be positioned, but assembly tolerance must be considered and gaps are left which cause assembly deviation
Solution Approach 1:
The patent incorporates positioning structures directly into the integrated mold assembly itself, such as positioning columns or positioning holes formed as integral parts of the mold. This preliminary positioning action ensures that the touch module components are precisely positioned during assembly within the mold, eliminating the need for additional positioning adjustments and gaps that would occur with separate positioning elements installed after assembly
3Ease of manufacture
If independent mold assemblies are used, then each component can be assembled separately, but when deviation is found after assembly it is difficult to determine the source of the assembly deviation
Solution Approach 1:
The integrated mold assembly incorporates reference marks or positioning features on the base that allow for precise measurement and feedback regarding the relative positions of all assembled components. Since all components are assembled within the same integrated mold structure, any position deviation can be traced back to specific mold elements or assembly steps by referencing these feedback markers, making it easy to identify the source of deviations while maintaining separate assembly capabilities for different components
Data Source
AI summary
A mold assembly for assembling a touch module in a housing is provided. The touch module comprises a carrier, a circuit board, and a touch film. The housing has an opening corresponding to the touch module, and there has a plurality of positioning elements and a plurality of securing elements around the opening. The mold assembly comprises a base, a first frame, and a second frame. The base has an upper surface with a concave corresponding to the carrier. The first frame is for detachably disposed on the first surface and has a first opening correspond to the circuit board. The second frame is for detachably disposed on the first surface and has a second opening corresponding to the touch film. An assembling method using the mold assembly is also provided.