Touch Module Perforated Pin Area Silver Paste Bonding
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Solution Overview
Problem
The existing touch module manufacturing methods, particularly screen printing and laser etching, face issues with silver paste separation due to positioning errors, leading to malfunctions in touch-sensitive electronics.
Innovation Solution
A touch module design featuring a substrate with perforations on the pin area of the touch electrode, allowing the silver paste to flow into these perforations and connect with the substrate, thereby preventing separation during laser etching and ensuring stable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If screen printing is used to coat silver paste on the substrate, then the silver paste can be precisely distributed on the substrate and pin area, but positioning errors may result in coating silver paste on the function area of the touch electrode, causing etching of the touch electrode and separation of silver paste and ITO
Solution Approach 1:
The patent applies preliminary action by creating perforations in the pin area before coating the silver paste. These perforations are pre-positioned to ensure that even if the silver paste coating has positioning errors, the paste will flow into the perforations and bond to the substrate, preventing separation during subsequent laser etching processes.
Solution Approach 2:
The perforations act as an intermediary structure between the silver paste and the substrate. They provide a mechanical interlocking mechanism that mediates the bonding interface, ensuring stable connection even when the silver paste is not precisely positioned during screen printing.
2Ease of manufacture
If laser etching is performed on the silver paste to create traces, then the silver paste traces can be formed for electrical connection, but positioning errors may cause the laser to etch the touch electrode instead of only the silver paste, resulting in separation and malfunction
Solution Approach 1:
The perforations are created in advance in the pin area before laser etching. This preliminary structure ensures that during laser etching, the silver paste will flow into these pre-formed perforations, maintaining bonding stability and preventing touch electrode etching even if laser positioning has errors.
Solution Approach 2:
The perforations serve as a cushioning mechanism that compensates for potential laser positioning errors. By providing a pre-formed bonding structure, they cushion against the harmful effects of positioning deviations during the laser etching process, preventing damage to the touch electrode.
3Strength
If the pin area is made larger to ensure proper silver paste coating, then the bonding area increases, but the touch electrode area is reduced, affecting the touch-sensitive functionality
Solution Approach 1:
The patent applies local quality by concentrating the bonding function in the pin area with perforations, while keeping the main touch electrode area intact. The perforations are locally positioned in the pin area to provide enhanced bonding without affecting the overall touch electrode functionality or area.
Solution Approach 2:
The perforated pin area acts as a porous structure that enhances bonding capability. The porous nature of the perforated region provides increased surface area and mechanical interlocking for the silver paste, achieving strong bonding without expanding the pin area footprint that would reduce the touch electrode area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The perforations on the pin area of the touch electrode effectively reduce silver paste separation, enhancing the bonding between the silver paste and the substrate, thus improving the reliability and performance of touch-sensitive electronics by minimizing malfunctions caused by positioning errors.
Implementation Method 1
The silver paste on the pin area flows into the perforations to connect to the substrate
Implementation Method 2
laser etching a trace on the silver paste to create a silver paste trace
Data Source
AI summary
A touch module for preventing separation of silver paste between laser etching traces, comprises a substrate, a plurality of touch electrodes, and a silver paste. A side of the touch electrode has a pin area. The pin area contains a plurality of perforations. The silver paste is coated on the substrate and the pin area for connecting electrical circuitry between the pin area and the connection line area. Wherein the silver paste on the pin area flows into the perforations and connects to the substrate. Therefore separation of the silver paste on the pin area and touch electrodes will less likely occur due to minor coating errors. The present invention also provides a manufacturing method of a touch module that prevents separation of the silver paste between laser etching traces.