Touch Panel Adhesive Composition High Molecular Weight Resin
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Solution Overview
Problem
Adhesives for touch panels face challenges with low heat resistance, leading to air pockets, bubbles, separation, and curling during high-temperature processes, and existing solutions fail to provide adequate durability and optical characteristics.
Innovation Solution
An adhesive composition comprising a base resin and a polyfunctional crosslinking agent, with a dynamic shear strength of 6 kg/cm² or more at 140°C, ensuring excellent heat resistance, wettability, and durability, and preventing panel warpage, separation, or curling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a low molecular weight oligomer is used to improve initial adhesion, then adhesion performance is improved, but heat resistance deteriorates causing air pockets and bubbles at high temperature
Solution Approach 1:
The patent changes the molecular weight parameter of the base resin to 500,000-900,000, which is significantly higher than conventional oligomers. This parameter change fundamentally alters the thermal behavior of the adhesive, enabling it to maintain adhesion strength at high temperatures (140°C or higher) without generating air pockets or bubbles, while still providing sufficient initial adhesion performance.
Solution Approach 2:
The patent creates a composite adhesive system by combining a high molecular weight base resin with a polyfunctional crosslinking agent. This composite structure provides both the initial adhesion properties needed for bonding and the heat resistance required to prevent separation and bubble formation during high-temperature curing processes (140°C or more).
2Reliability
If adhesive composition is cured at high temperature (140°C or more) to improve durability, then durability is improved, but low heat resistance adhesives cause separation and curls
Solution Approach 1:
The patent changes the molecular weight parameter of the base resin to 500,000-900,000, which fundamentally alters the thermal behavior of the adhesive. This high molecular weight configuration enables the adhesive to maintain its compositional stability at high curing temperatures (140°C or more), preventing separation, curls, and other degradation phenomena while achieving the desired durability through high-temperature curing.
3Length of moving object
If base film thickness is reduced to achieve slimness, then device thickness is reduced, but breakage resistance deteriorates
Solution Approach 1:
The patent employs a composite adhesive system combining high molecular weight base resin with polyfunctional crosslinking agent that creates a reinforced adhesive layer. This composite structure provides enhanced mechanical strength and breakage resistance to thin base films (50-200 μm), enabling the device to achieve slimness while maintaining adequate protection against breakage during handling and use.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition exhibits superior heat resistance and durability, maintaining adhesion and optical properties under high-temperature conditions, preventing warpage, separation, and curling, while ensuring excellent cuttability and workability.
Implementation Method 1
an adhesive composition comprising a base resin and a polyfunctional crosslinking agent
Implementation Method 2
excellent adhesion to various substrates
Data Source
Figure 1~2
Figure 3~5
AI summary
The present invention relates to an adhesive composition, to an adhesive sheet, and to a touch panel. The present invention provides an adhesive composition, particularly an adhesive composition for a touch panel, which is prepared without using a low molecular weight polymer as an additive. The adhesive composition, the adhesive sheet, and the touch panel of the present invention exhibit superior heat resistance in a hardening process, a printed circuit board assembly process, or the like, and have superior physical properties such as optical characteristics, wettability, cuttability, workability, anti-curling properties, and durability.