Touch Panel Manufacturing Using Batch Adhesive Bonding
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Solution Overview
Problem
The existing methods for manufacturing projective capacitance type touch panels are inefficient and prone to yield reduction due to the need for manual handling of single glass substrates, which increases manpower requirements and risks of contamination during sensor process execution.
Innovation Solution
A method involving a mother plate with multiple adhesive materials, where multiple cover glasses are attached and cured, allowing for simultaneous formation of circuit units on each cover glass, followed by removal using a scraper or butting process, ensuring sufficient bonding strength and preventing adhesive residue on the cover glasses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single glass substrate is processed manually for sensor processes, then the process can be completed, but the manufacturing efficiency is low and manpower requirements increase
Solution Approach 1:
Multiple glass substrates are combined and processed simultaneously on a single processing line. The patent describes processing multiple substrates together through sputtering, photo-resist coating, exposing, developing, and etching processes, thereby increasing manufacturing efficiency and reducing manpower requirements while maintaining quality standards
2Reliability
If a single glass substrate is handled manually, then the process can proceed, but the yield rate decreases due to contamination risks
Solution Approach 1:
Multiple glass substrates are processed simultaneously in a controlled environment, reducing the number of manual handling operations. The patent describes a batch processing approach where substrates are handled together through various sensor processes, minimizing contamination risks and improving yield rate
3Strength
If adhesive material bonding strength is increased, then the cover glass attaches firmly to the mother plate, but adhesive residue remains on the cover glass surface during removal
Solution Approach 1:
The patent describes optimizing adhesive material parameters including bonding strength within a specific range (5-600 g/25mm), adhesive layer thickness (1-10 micrometers), and curing conditions. These parameter adjustments ensure sufficient bonding during processing while allowing clean removal without residue
Solution Approach 2:
The adhesive material is applied in controlled amounts with specific thickness parameters to achieve optimal bonding. The patent describes using just enough adhesive to secure the cover glass during processing, then removing excess material to prevent residue during subsequent removal operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the simultaneous execution of multiple sensor processes on multiple cover glasses, enhancing manufacturing efficiency and reducing manual handling errors, while maintaining adequate bonding strength for integrated circuit units.
Implementation Method 1
A plurality of adhesive materials are formed on the mother plate. A plurality of cover glasses are disposed on the adhesive materials respectively. The adhesive materials are cured, whereby the cover glasses are attached to the mother plate.
Implementation Method 2
The bonding strength of the cured adhesive material is within a range about between 5 g/25 mm and 600 g/25 mm, whereby the adhesive material provides enough adhesive force between the cover glass and the mother plate, and the adhesive material cannot be stayed on a surface of the cover glass during a removing process.
Data Source
AI summary
A method for manufacturing a touch panel includes the following steps. A mother plate is provided. A plurality of adhesive materials are formed on the mother plate. A plurality of cover glasses are disposed on the adhesive materials respectively. The adhesive materials are cured, whereby the cover glasses are attached to the mother plate. A plurality of circuit units are formed on the cover glasses respectively. The cover glass having the circuit unit is removed from the mother plate, wherein the bonding strength of the cured adhesive material is within a range about between 5 g/25 mm and 600 g/25 mm, whereby the adhesive material provides enough adhesive force between the cover glass and the mother plate, and the adhesive material cannot be stayed on a surface of the cover glass during a removing process.