Touch Panel Bonding Pad Bending for Narrow Bezel
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Solution Overview
Problem
The challenge is to increase the size of a touch panel's screen without increasing the overall size of the device, particularly in portable electronic devices, where a larger screen size affects ergonomics and user comfort.
Innovation Solution
A touch panel design featuring a sensing area surrounded by a periphery area with wires and bonding pads, where the bonding pads have bending portions or oblique connections, reducing the peripheral area and enhancing adhesion between the circuit board and bonding pads, thereby minimizing the device's size while maximizing the viewable screen area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the screen size is increased, then the viewing area is improved, but the overall device size increases
Solution Approach 1:
The bonding pads are designed with bending portions that extend in multiple directions, utilizing two-dimensional space more efficiently. This allows the bonding pads to connect to wires in different orientations, reducing the linear distance required and enabling compact layout that maximizes screen area without proportionally increasing device dimensions
Solution Approach 2:
The bonding pads incorporate curved bending portions instead of straight lines, allowing them to navigate around obstacles and connect to wires more efficiently within a compact area. The curved geometry enables better space utilization in the peripheral area, reducing the overall device footprint while maintaining screen size
2Area of moving object
If the peripheral area is reduced, then the screen area ratio is improved, but the adhesion between bonding pads and circuit board may be weakened
Solution Approach 1:
The bending portions of the bonding pads provide curved connection paths that distribute mechanical stress more evenly across the bonding interface. This curved geometry prevents stress concentration at sharp corners, enhancing the adhesion reliability between bonding pads and circuit board even when the peripheral area is minimized
Solution Approach 2:
The bonding pads utilize multi-directional bending to achieve connections in a compact footprint. By extending in multiple directions rather than straight lines, the bonding pads maintain adequate bonding area and stress distribution while fitting within a reduced peripheral area, thus preserving adhesion strength
Data Source
AI summary
A touch panel comprises a sensing area, a periphery area, a plurality of wires and a plurality of bonding pads. The periphery area is disposed around the sensing area. The periphery area comprises a bonding area. The wires are disposed in the periphery area. The bonding pads are disposed in the bonding area and electrical connected to the wires correspondingly. Each of the bonding pads comprises at least a bending portion.