Touch Panel Bridging Structure for Narrow-Bezel Signal Routing

The patent transitions from a two-dimensional planar layout to a three-dimensional stacked architecture by introducing a bridging layer that vertically connects electric contacts across different layers. This dimensional change allows signal routing to occur in the vertical direction rather than being constrained to the horizontal plane, thereby enabling reduced circuit area width while maintaining adequate signal wire layout space and simplifying manufacturing processes.

The patent segments the connecting portion into multiple independent electric contacts distributed across different layers and positions. Instead of relying on a single large connecting portion, the connection is divided into numerous smaller contact points that collectively provide stable electrical connection. This segmentation allows the overall connecting portion size to be reduced while maintaining or even improving connection reliability through distributed contact points.

The patent utilizes the vertical dimension by stacking multiple layers of electric contacts and signal wires. This three-dimensional arrangement allows numerous transmission lines to be organized in multiple layers rather than crowded in a single plane. The vertical separation between layers reduces the risk of line breakage and alignment errors that would occur with increased horizontal density, enabling high transmission line counts while maintaining manufacturing precision.