Touch Panel Cavity Packaging for Chip Protection
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Solution Overview
Problem
Conventional chip packages with sensing functions are prone to contamination and damage during manufacturing, leading to reduced yield and liability, especially when using thin substrates, and touch panels with sensing capabilities are easily damaged due to user interaction.
Innovation Solution
A touch panel-sensing chip package module complex is developed, featuring a touch panel with cavities for housing chip scale sensing chip packages, which include a sensing chip, conductive structure, and a rigid-flexible circuit board, along with a cap layer and adhesive layers for enhanced protection and connectivity, and a manufacturing method that involves bonding these components together to form independent modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a thin substrate is used to meet size-miniaturization requirements, then the thickness of the substrate is reduced, but the substrate becomes easily bent or damaged during the package process, reducing yield
Solution Approach 1:
A reinforcement layer is formed on the thin substrate before the packaging process to provide mechanical support and prevent bending or damage during subsequent packaging operations. This reinforcement layer acts as a cushioning structure that compensates for the inherent weakness of thin substrates.
Solution Approach 2:
The substrate structure is designed as a composite by forming a reinforcement layer on the thin substrate. This composite structure combines the thin substrate (for miniaturization) with the reinforcement layer (for mechanical strength), achieving both size reduction and damage prevention.
2Adaptability or versatility
If conventional chip packages with sensing functions are used, then sensing capability is provided, but the packages are easily contaminated or damaged during manufacturing processes, decreasing yield and liability
Solution Approach 1:
The chip package structure is segmented into distinct functional layers including the substrate, sensing chip, reinforcement layer, and encapsulation structure. This segmentation allows each layer to be optimized independently and facilitates cleaner manufacturing processes with reduced contamination risk.
Solution Approach 2:
The reinforcement layer is formed on the substrate before the sensing chip is mounted and before subsequent packaging steps. This preliminary action prepares the substrate in advance to withstand upcoming manufacturing processes, preventing damage before it can occur.
3Strength
If scratch-resistance material such as sapphire is used as the touch pad to protect semiconductor devices, then protection capability is improved, but production cost increases
Solution Approach 1:
Instead of using expensive sapphire material for the entire touch panel, the reinforcement layer is applied locally on the substrate where mechanical strength is needed. This localized approach provides necessary protection while using more cost-effective materials and reducing overall production costs.
Solution Approach 2:
The reinforcement layer uses cost-effective materials that provide adequate protection for the sensing chip during manufacturing and use. Rather than using expensive sapphire throughout, this approach employs economical materials that fulfill the protection function without excessive cost.
Data Source
AI summary
This invention provides a touch panel-sensing chip package module complex, comprising: a touch panel with a first top surface and a first bottom surface opposite to each other, wherein the first bottom surface having a first cavity with a bottom wall surrounded by a sidewall; a color layer formed on the bottom wall and the first bottom surface adjacent to the cavity; and a chip scale sensing chip package module bonded to the cavity by the color layer formed on the bottom wall of the cavity.