Touch Panel Substrate Integration via Dry Patterning
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Solution Overview
Problem
Conventional capacitive touch panels require multiple substrates due to the wet-etching process, leading to increased complexity, thickness, and potential damage to integrated components like liquid crystal or color filters, and substrate bonding issues.
Innovation Solution
The touch circuit is integrated onto a cover lens, a color filter substrate, or a polarizer using dry patterning methods like jet-printing and laser imprinting, reducing the number of substrates needed and avoiding damage to pre-formed elements, with UV film optical glue and vacuum bonding to enhance bonding quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wet-etching process is used to form touch circuit, then circuit can be formed on glass substrate, but the number of substrates increases and overall thickness increases
Solution Approach 1:
The patent merges the touch circuit formation process with the cover lens substrate by integrating the ITO patterned circuit directly onto the cover lens. This eliminates the need for separate substrate bonding steps and reduces the overall number of substrates, thereby decreasing the overall thickness of the touch panel while maintaining circuit formation capability.
Solution Approach 2:
The patent transitions from a multi-substrate stacked architecture to a integrated single-substrate architecture by forming the touch circuit on the cover lens surface. This dimensional reorganization eliminates intermediate bonding layers and reduces the overall thickness in the vertical dimension.
2Manufacturing precision
If wet-etching process is used with photoresist application, then circuit patterning can be achieved, but liquid crystal or color filter may be damaged
Solution Approach 1:
The patent applies for a protective film to be formed on the liquid crystal or color filter layers before the wet-etching process. This preliminary protective action prevents etchant damage to sensitive components while allowing the circuit patterning process to proceed with high precision.
Solution Approach 2:
The patent introduces a protective film as an intermediary layer between the wet etchant and the sensitive liquid crystal or color filter components. This intermediary protects the sensitive elements from harmful etchant exposure while allowing the circuit patterning to be performed on the ITO layer.
3Adaptability or versatility
If multiple substrates are bonded together, then touch circuit and display elements can be integrated, but bonding complexity increases and yield decreases
Solution Approach 1:
The patent combines the touch circuit substrate and cover lens into a single integrated component, eliminating the need for separate substrate bonding processes. This merging reduces bonding complexity, minimizes the number of interfaces requiring alignment, and improves manufacturing yield while maintaining full integration capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of substrates required, decreases the overall thickness of the touch panel, simplifies the bonding process, and minimizes damage to integrated components, resulting in a more efficient and thinner touch panel design.
Implementation Method 1
dry patterning methods like jet-printing and laser imprinting
Implementation Method 2
dry patterning methods like jet-printing and laser imprinting
Implementation Method 3
UV film optical glue and vacuum bonding to enhance bonding quality
Implementation Method 4
UV film optical glue and vacuum bonding to enhance bonding quality
Data Source
Figure 1~2(e)
Figure 3~5
Figure 6~8
AI summary
A touch panel is presented, which includes a first substrate, a second substrate, and a third substrate. The first substrate (301) includes a first side having a first circuit (3011). The second substrate (302) includes a first side arranged on the first side of the first substrate and a second side having a second circuit (3021). The third substrate (303) is arranged on the second side of the second substrate. Therefore, by using the structure of the touch panel, the substrates of the touch panel can be integrated, so as to achieve the objective of decreasing the overall thickness of an electronic device.