Touch Panel Dummy Patterns for Uniform Metal Wire Etching
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Solution Overview
Problem
The tight pattern density of the first metal wire in touch panels leads to uneven etching rates during dry etching, resulting in inverted-tapered cross-sections and film residue deposition, causing leaks between second metal wires.
Innovation Solution
Incorporating a bridge pattern connecting second metal wire patterns and a dummy pattern insulated from the bridge pattern, with the dummy pattern increasing the first metal wire's density and reducing etching rate differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the first metal wire has a tight pattern density to achieve high-resolution touch panel, then the manufacturing precision is improved, but the etching rate becomes uneven causing inverted-tapered cross-sections and film residue deposition
Solution Approach 1:
The patent applies local quality by introducing a dummy pattern specifically in the region where the first metal wire has tight pattern density. This dummy pattern is insulated from the bridge pattern and selectively placed to address local etching rate variations without affecting the overall tight pattern density required for high-resolution touch panel manufacturing.
Solution Approach 2:
The dummy pattern acts as an intermediary element between the bridge pattern and the tight pattern density region. It mediates the etching process by providing a buffer zone that reduces the etching rate difference in the tight pattern density region, preventing both over-etching and film residue deposition while maintaining the required manufacturing precision.
2Manufacturing precision
If the first metal wire has a tight pattern density to achieve high-resolution touch panel, then the manufacturing precision is improved, but the side shift of the metal wire progresses causing inverted-tapered cross-sections
Solution Approach 1:
The dummy pattern is strategically positioned in the local region where the first metal wire exhibits tight pattern density and is prone to side shift. This localized approach prevents the inverted-tapered cross-section formation without compromising the overall high-resolution pattern density required for touch panel manufacturing.
Solution Approach 2:
The dummy pattern serves as a protective cushion introduced beforehand in the critical region. It prevents the bridge pattern from experiencing excessive side shift during etching by providing a buffer zone that stabilizes the etching rate, thereby maintaining the desired cross-section shape while preserving manufacturing precision.
3Manufacturing precision
If the first metal wire has a tight pattern density to achieve high-resolution touch panel, then the manufacturing precision is improved, but film residue deposits on level difference portions causing leaks between second metal wires
Solution Approach 1:
The dummy pattern is introduced specifically in the region where tight pattern density causes film residue deposition. This localized modification prevents harmful film residue accumulation on level difference portions without affecting the overall high-resolution pattern density, thereby eliminating leaks between second metal wires while maintaining manufacturing precision.
Solution Approach 2:
The dummy pattern acts as an intermediary protective element between the bridge pattern and the tight pattern density region. It mediates the harmful effect of film residue deposition by providing a buffer zone that prevents residue accumulation on level difference portions, thereby preventing leaks while preserving the required manufacturing precision.
Data Source
AI summary
A touch panel includes: a first metal wire formed on an underlayer; an insulating film formed to cover the first metal wire; and a second metal wire formed on the insulating film. The second metal wire has: a first pattern extending in a first direction; and a plurality of second patterns formed to be insulated from the first pattern. The first metal wire has: a bridge pattern connecting together, in a second direction, a pair of second patterns arranged to sandwich the first pattern; and a dummy pattern formed to be insulated from the bridge pattern, the second direction intersecting with the first direction, and the pair of second patterns being included in the plurality of second patterns.