Touch Panel Electrode Leads Transparent Conductive Protection
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Solution Overview
Problem
Existing touch panel manufacturing methods face challenges with metal leads oxidation, leading to increased resistance and difficulty in etching, especially with laminate structures like molybdenum niobium/aluminum neodymium/molybdenum, which are costly and require additional processing steps.
Innovation Solution
The use of transparent conductive layers, such as indium tin oxide or zinc oxide, formed on the surfaces of electrode leads to enclose and protect them, eliminating the need for separate protection layers and reducing manufacturing steps by integrating these layers with the electrodes and connecting wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a laminate structure of molybdenum niobium/aluminum neodymium/molybdenum niobium is used for metal leads, then oxidation resistance is improved, but manufacturing cost increases and etching difficulty increases
Solution Approach 1:
The patent replaces expensive metal laminate structures with a cheaper transparent conductive material layer that provides sufficient protection against oxidation. The transparent conductive layer serves as a disposable protective coating that prevents oxidation without requiring complex metal laminate structures, thereby reducing manufacturing cost while maintaining oxidation resistance.
Solution Approach 2:
The patent uses a composite structure combining transparent conductive material with the metal lead layer. This composite approach allows the transparent conductive material to provide oxidation protection while the metal layer provides electrical conductivity, achieving both protection and cost-effectiveness without requiring complex multi-layer metal laminates.
2Reliability
If a laminate structure of molybdenum niobium/aluminum neodymium/molybdenum niobium is used for metal leads, then oxidation resistance is improved, but etching difficulty increases
Solution Approach 1:
The patent replaces hard-to-etch metal laminate structures with a transparent conductive material layer that is easier to process. The transparent conductive layer can be deposited and patterned using standard semiconductor fabrication techniques, significantly reducing etching difficulty compared to metal laminate structures.
Solution Approach 2:
The patent changes the material parameter from metal laminate to transparent conductive material, which has different etching characteristics. The transparent conductive material can be removed or patterned more easily using conventional photolithography and etching processes, thereby reducing etching difficulty while maintaining protection functions.
3Reliability
If separate protection layers are provided on upper and lower surfaces of metal leads, then oxidation protection is improved, but device complexity increases
Solution Approach 1:
The patent merges the protection function into a single transparent conductive layer that covers the metal lead structure. Instead of providing separate protection layers on upper and lower surfaces, the transparent conductive material forms a continuous protective barrier that simplifies the overall structure while maintaining comprehensive oxidation protection.
Solution Approach 2:
The transparent conductive layer serves multiple functions simultaneously: it provides oxidation protection, maintains electrical conductivity, and simplifies the structural design. This multi-functional approach eliminates the need for separate protection layers, thereby reducing device complexity while achieving comprehensive protection.
4Reliability
If separate protection layers are provided on upper and lower surfaces of metal leads, then oxidation protection is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent combines the protection function into a single transparent conductive layer deposition process. Instead of requiring separate processes for depositing protection layers on upper and lower surfaces, the transparent conductive material is deposited in one process step, significantly reducing manufacturing process complexity.
Solution Approach 2:
The transparent conductive layer provides multiple functions including oxidation protection and electrical conductivity through a single manufacturing process. This eliminates the need for separate protection layer processes, thereby reducing overall process complexity while maintaining comprehensive oxidation protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution prevents oxidation of electrode leads, enhances adhesion, and simplifies the manufacturing process by eliminating the need for additional protection layers, thereby reducing costs and improving production efficiency.
Implementation Method 1
at least one transparent conductive layer which is formed on at least one surface of each of the first and/or second electrode leads
Data Source
AI summary
Embodiments of the present disclosure discloses a touch panel; a plurality of second electrodes; a plurality of the first electrode leads for leading the first electrodes, which are connected to each other, out of a touch area; a plurality of the second electrode leads for leading the second electrodes, which are connected to each other, out of the touch area. The touch panel further includes at least one transparent conductive layer which is formed on at least one surface of each of the first and/or second electrode leads and which is formed in the same layer as at least one of the first and second electrodes, the first and second connecting wires. The embodiments of the present disclosure may prevent oxidation of the electrode leads and increase adhesion without increasing manufacture processes.