Touch Panel Module Anti-EMI Layer Integration
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Solution Overview
Problem
Traditional touch panels face challenges with increased thickness and complex manufacturing processes due to the need for an additional anti-electromagnetic interference layer, which complicates their integration with other electronic components.
Innovation Solution
The anti-interference conductive layer is directly formed on an adhesive layer within the touch panel module, eliminating the need for a separate substrate and simplifying the manufacturing process, while maintaining anti-electromagnetic interference functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an anti-electromagnetic interference layer is added as a separate conductive layer on another substrate, then the anti-electromagnetic interference performance is improved, but the thickness of the touch panel increases and the manufacturing process becomes more complicated
Solution Approach 1:
The patent merges the anti-electromagnetic interference layer with the adhesive layer by directly forming the conductive layer on the adhesive layer during the touch panel manufacturing process. This integration eliminates the need for a separate anti-interference layer and its additional substrate, thereby reducing structural complexity while maintaining electromagnetic shielding functionality.
2Object-affected harmful factors
If an anti-electromagnetic interference layer is added as a separate conductive layer on another substrate, then the anti-electromagnetic interference performance is improved, but the thickness of the touch panel increases
Solution Approach 1:
The patent combines the anti-electromagnetic interference layer with the adhesive layer into a single integrated structure. By directly forming the conductive layer on the adhesive layer, the patent eliminates the additional substrate and reduces the overall thickness of the touch panel while maintaining the electromagnetic interference shielding function.
3Object-affected harmful factors
If an anti-electromagnetic interference layer is added as a separate conductive layer on another substrate, then the anti-electromagnetic interference performance is improved, but the manufacturing process becomes more complicated
Solution Approach 1:
The patent integrates the anti-electromagnetic interference layer formation into the existing adhesive layer manufacturing process. By directly forming the conductive layer on the adhesive layer, the patent eliminates separate manufacturing steps for the anti-interference layer, thereby simplifying the overall manufacturing process while maintaining electromagnetic shielding performance.
Solution Approach 2:
The patent performs the anti-electromagnetic interference layer formation in advance during the adhesive layer manufacturing process, before the touch panel assembly is completed. This preliminary action integrates the anti-interference functionality into the existing manufacturing flow, avoiding additional separate manufacturing steps.
Data Source
AI summary
A touch panel module includes a substrate, a sensor layer disposed on the substrate, a first glue layer disposed on the sensor layer and an anti-electromagnetic interference layer disposed on the first glue layer. The touch panel module with anti-electromagnetic interference can be formed independently, and may be combined with other electronic device to form a touch device, thereby reducing the thickness of the touch device and simplifying the process steps.


