Touch Panel Grounding Component Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional touch panels face issues with the reliability of grounding components peeling off from the substrate due to poor adherence, leading to manufacturing complexities and reduced yield, especially when dealing with different substrate materials and large-area metal blocks.
Innovation Solution
The touch panel design incorporates a grounding component with alternating hollow and conductive portions, where the conductive portions are formed with a width less than 60 μm and the hollow portions are similarly spaced, reducing the contact area and preventing peeling by slicing metal blocks into patterns with grating, matrix, or zigzag forms, and adjusting the layer lamination sequence to simplify manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If large-area metal blocks are used for grounding components, then grounding effectiveness is improved, but adherence to substrate deteriorates causing peeling
Solution Approach 1:
The grounding component is segmented into multiple conductive portions separated by hollow portions, transforming a single large-area metal block into a patterned structure with distributed conductive regions. This segmentation maintains total conductive area for effective grounding while reducing continuous metal-substrate contact that causes peeling.
Solution Approach 2:
The grounding component employs alternating conductive and hollow portions, creating local variations in material distribution. The conductive portions provide grounding function while the hollow portions reduce overall metal area and improve adherence, allowing each local region to optimize for its specific function.
2Ease of manufacture
If conventional layer lamination sequence is used, then manufacturing process is established, but manufacturing complexity increases and productivity decreases
Solution Approach 1:
The patent inverts the conventional manufacturing sequence by forming the signal wire layer before the sensitive layer. This reversal eliminates the need for complex etching solutions and protective measures required when metal layers are present during transparent conducting layer fabrication, thereby simplifying the process and improving productivity.
3Reliability
If conventional grounding component design is used, then grounding function is provided, but manufacturing yield reduces due to peeling issues
Solution Approach 1:
By segmenting the grounding component into alternating conductive and hollow portions, the patent eliminates the peeling problem that plagues conventional large-area grounding components. This segmentation ensures reliable grounding function while improving manufacturing yield through enhanced adherence.
Data Source
AI summary
A touch panel is disclosed, which includes a substrate, plural sensing units, plural wires, and a grounding component. The substrate includes a touch area and a wiring area surrounding the touch area. The sensing units are formed in the touch area. The wires are formed in the wiring area and are connected to the sensing units. The ground component is formed in the wiring area and includes plural hollow portions and conductive portions. At least parts of the hollow portions and at least parts of the conductive portions are alternatingly arranged. The situation of metal peeling can be prevented by slicing the grounding component in the touch panel.