Touch Display Panel Interconnect Layout for Reduced Thickness
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Solution Overview
Problem
The overall thickness of touch display devices with touch display panels is increased due to the integration of touch sensing units on independent panels, necessitating a reduction in thickness.
Innovation Solution
The design incorporates a first insulating layer with a conductive portion and a transistor, where the conductive portions are strategically positioned to reduce thickness, with the electronic unit and second conductive portion placed on opposite sides of the insulating layer, allowing for efficient electrical connections and reduced wiring requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If touch sensing units are formed on an independent touch panel, then touch sensing functionality is achieved, but the overall thickness of the touch display device is increased
Solution Approach 1:
The patent merges the touch sensing circuit and sensing lines directly into the display panel structure, eliminating the need for an independent touch panel. The sensing lines are integrated within the display panel layers, and the touch sensing circuit is formed using the same thin-film transistor fabrication process as the display driver, achieving functional integration while reducing overall device thickness.
Solution Approach 2:
The patent transitions from a three-layer stacked structure (display panel + touch panel + controller) to a more integrated dimensional arrangement where sensing lines are embedded within the display panel's thin-film transistor layers. This dimensional reorganization allows touch sensing functionality to be achieved within the same plane and thickness envelope as the display panel itself.
2Reliability
If the conductive portion length along the second direction is increased, then electrical connection reliability is improved, but the area occupied in the plane is increased
Solution Approach 1:
The patent applies different conductor material properties and cross-sectional areas at different locations along the conductive path. The conductive portion has varying dimensions optimized for its specific function: wider sections for current carrying, narrower sections for signal transmission, and strategically placed via holes for vertical interconnects. This local optimization allows reliable electrical connection with minimized overall area occupation.
Data Source
AI summary
An electronic device includes a first insulating layer, a first conductive portion, a second conductive portion, a transistor, and an electronic unit. The first insulating layer has a first opening penetrating the first insulating layer along a first direction. The first conductive portion is disposed in the first opening. The second conductive portion is electrically connected to the first conductive portion. The transistor is electrically connected to the second conductive portion. The electronic unit is electrically connected to the first conductive portion. In a cross-sectional view of the electronic device, the electronic unit and the second conductive portion are disposed on two opposite sides of the first insulating layer respectively, the first conductive portion has a first length along a second direction perpendicular to the first direction, the second conductive portion has a second length along the second direction, and the first length is different from the second length.