Touch Panel Narrow Border Design via Layered Routing

The patent transitions from a planar routing approach to a three-dimensional layered approach. Conductive lines are routed through multiple layers (first conductive layer, second conductive layer) and utilize vertical stacking to connect sensing electrodes to bonding pads. This dimensional change allows lines to pass through the sensing area without extending the border width, as connections are achieved via vertical layer transitions rather than lateral extensions.

The patent implements nested routing where conductive lines are embedded within the sensing series structure itself. The first and second conductive lines are positioned between electrode portions and crossing portions, nesting the routing path within the existing sensing pattern. This eliminates the need for separate border regions, as the routing is integrated into the sensing series geometry.

The patent uses multi-layer conductive structures to achieve reliable electrical connections without lateral reserve areas. Conductive lines traverse through vertically stacked layers (first conductive layer, second conductive layer, third conductive layer) with insulation layers providing electrical isolation. This vertical dimensionality allows robust connections while maintaining narrow borders, as reliability is achieved through layered redundancy rather than lateral spacing.

The patent introduces insulation layers as intermediary elements between conductive lines and sensing electrodes. These insulation layers (first insulation layer, second insulation layer) mediate the electrical connection by providing controlled isolation while allowing capacitive coupling for touch sensing. This intermediary approach ensures reliable signal transmission without direct physical contact, enabling narrow border design while maintaining connection reliability.