Touch Panel Pad Segmentation for Uniform ACF Bonding
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Solution Overview
Problem
The bonding process of touch panels in general display devices often results in incomplete filling of the anisotropic conductive film between the touch panel pads and flexible circuit board pads, leading to defective contact due to localized pressure during the bonding process.
Innovation Solution
The touch panel integrated flat display device features touch panel pads with multiple contact areas that are thermally pressed with flexible circuit board pads using an anisotropic conductive film, ensuring uniform pressure and complete filling of the conductive film, thereby enhancing the attachment force between the pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the pad of the touch panel and the pad of the flexible circuit board are formed to each other during the bonding process, then electrical connection is achieved, but localized pressure is generated only in the pad area causing the anisotropic conductive film to be insufficiently filled
Solution Approach 1:
The touch panel pad is divided into multiple contact areas instead of a single pad structure. This segmentation allows pressure to be distributed across multiple regions during bonding, ensuring the anisotropic conductive film is sufficiently filled between the touch panel and flexible circuit board pads, thereby resolving the contradiction between bonding reliability and manufacturing precision
Solution Approach 2:
The invention creates different local structures within the pad area by forming multiple contact areas with varying positions and sizes. This local quality variation ensures that pressure is appropriately distributed in different regions during bonding, allowing the anisotropic conductive film to be completely filled while maintaining reliable electrical connection
2Force
If pressure is applied during the bonding process, then the anisotropic conductive film is pressed between the pads, but the pressure is not uniformly distributed causing incomplete filling
Solution Approach 1:
By segmenting the pad into multiple contact areas, the bonding pressure is distributed across multiple regions rather than concentrated in one area. This segmentation ensures uniform pressure distribution during the bonding process, allowing the anisotropic conductive film to be completely and uniformly filled, thereby improving contact quality and reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the reliability of the touch panel integrated flat display device by ensuring a uniform pressure distribution during bonding, which results in a more robust connection between the touch panel and flexible circuit board pads, enhancing the overall reliability of the device.
Implementation Method 1
The pad of the touch panel and the pad of the flexible circuit board are electrically connected to each other by thermally pressing an anisotropic conductive film using a bonding machine
Implementation Method 2
The anisotropic conductive film is an adhesive film including conductive particles
Implementation Method 3
The anisotropic conductive film is an adhesive film including conductive particles
Data Source
AI summary
A touch panel integrated flat display device capable of improving reliability is disclosed.The touch panel integrated flat display device includes a display panel, a touch panel disposed on the display panel, and a flexible circuit board electrically connecting a drive PCB and the touch panel to supply a drive signal of the touch panel. In the touch panel integrated flat display device, a plurality of touch panel pads contacting a plurality of flexible circuit board pads are formed at a side of the touch panel, and each of the touch panel pads has at least two contact areas with each of the flexible circuit board pads.