Touch Panel Protrusion Buffer Reduces Via-Hole Slope
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Solution Overview
Problem
In OLED touch display products, the formation of touch electrodes with metal bridges results in a large slope of via-holes during the patterning process, leading to a high risk of wire breakage at overlapping points, which degrades the yield of touch display products.
Innovation Solution
A touch panel design featuring a buffer layer with protrusions, overlapping components, and a first insulation layer, where the touch electrodes overlap through via-holes extending through the insulation layer, with the protrusions reducing the depth of the via-holes and minimizing the slope, thereby preventing wire breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If via-holes are formed to connect overlapping metal layers in OLED touch displays, then electrical connection is achieved, but the large slope of via-holes causes wire breakage at overlapping points
Solution Approach 1:
The buffer layer with protrusions is formed in advance before depositing the insulation layer and creating via-holes. The protrusions pre-establish elevated positions that reduce the depth and slope of subsequent via-holes, preventing wire breakage before the connection process occurs
Solution Approach 2:
The buffer layer is designed with localized protrusions only at specific positions where via-holes need to be formed, rather than uniformly across the entire layer. This local modification optimizes via-hole geometry precisely where needed without affecting other areas
2Reliability
If the overall thickness of the insulation layer is reduced to minimize via-hole depth, then wire breakage risk decreases, but the insulation capability and structural integrity are compromised
Solution Approach 1:
Instead of reducing the insulation layer thickness in the vertical dimension, the solution introduces a horizontal dimension by creating protrusions on the buffer layer. This allows via-holes to be shallower while maintaining adequate insulation thickness in the vertical direction for electrical isolation
Solution Approach 2:
The protrusions act as intermediary structures between the buffer layer and the insulation layer. They provide elevated positions that reduce via-hole depth without requiring reduction of the overall insulation layer thickness, thus maintaining both electrical isolation and connection reliability
Data Source
AI summary
The disclosure discloses a touch panel, a method for fabricating the same, and a touch device; where the touch panel includes: a buffer layer with protrusions, overlapping components, a first insulation layer, and touch electrodes, which are arranged on a substrate in that order, where the touch electrodes overlap with the overlapping components through via-holes extending through the first insulation layer, and at least portions, of the overlapping components, overlapping with the touch electrodes are on the protrusions.