Touch Panel Shielding Layer Simultaneous Formation

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Solution Overview

Problem

The existing manufacturing process of touch panels requires an additional step for forming a shielding layer, increasing costs and complexity due to the need for a separate process step.

Innovation Solution

The shielding layer is formed simultaneously with the bridging structures using the same materials during the touch panel manufacturing process, eliminating the need for an individual process step and simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a shielding layer is added to the touch panel to prevent electronic signal interference, then the anti-interference capability is improved, but the manufacturing process complexity and cost increase due to requiring an additional process step

Engineering Contradiction:
Improveanti-interference capabilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the formation of the shielding layer with the formation of the bridging structures by applying the same conductive material layer simultaneously for both purposes. This single process step replaces what would traditionally be separate manufacturing steps, reducing process complexity while maintaining the shielding function for anti-interference capability.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If a shielding layer is added to the touch panel to prevent electronic signal interference, then the anti-interference capability is improved, but the manufacturing cost increases due to requiring an additional process step

Engineering Contradiction:
Improveanti-interference capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines the shielding layer formation with the bridging structure formation into a single material deposition step. By using the same conductive material layer for both functions simultaneously, the patent eliminates the need for a separate shielding layer process step, thereby reducing manufacturing cost while maintaining the required anti-interference capability.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If a shielding layer is added to the touch panel to prevent electronic signal interference, then the anti-interference capability is improved, but the manufacturing time increases due to requiring an additional process step

Engineering Contradiction:
Improveanti-interference capabilityVSAvoidmanufacturing time
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent integrates the shielding layer formation with the bridging structure formation into a single simultaneous process step. By depositing the conductive material layer that serves both as shielding layer and bridging structures in one operation rather than sequentially, the patent reduces manufacturing time while maintaining the necessary anti-interference capability.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS9214290B2Touch panel and manufacturing method thereof
Publication Date: 2015.12.15 TPK TOUCH SOLUTIONS (XIAMEN) INC
  • US9214290B2 patent drawing
  • US9214290B2 patent drawing
  • US9214290B2 patent drawing

AI summary

A touch panel having a shielding layer and a manufacturing method thereof is provided. A manufacturing method of the touch panel comprises the steps of forming a plurality of first conductive axes and a plurality of second conductive units on a substrate; covering the first conductive axes and the second conductive units with an insulating layer and exposing at least a partial set of second conductive units; and forming a plurality of bridging structures and a shielding layer on the insulating layer simultaneously, wherein the bridging structures electrically connect to the second conductive units. The proposed method allows the shielding layer to be formed during the formation of the bridging structures, thereby eliminating the step of forming the shielding layer separately through an independent process, which saves costs and time.