Touch Panel Layer Structure for Stress Buffering and Adhesion
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Solution Overview
Problem
Current touch panel structures and manufacturing processes face challenges in achieving a lighter, thinner, and cost-effective design while maintaining optimal performance and appearance, particularly in reducing stress and erosion between layers and ensuring proper adhesion.
Innovation Solution
The proposed touch panel structure includes a cover plate, a thin film layer, a buffer layer, and a sensing layer, with the bonding layer located between the cover plate and the thin film layer, and the buffer layer situated between the thin film layer and the sensing layer, which helps in reducing stress and erosion, and improving adhesion by using a composite material with adjustable refractive index and thermal expansion coefficients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a traditional multi-layer touch panel structure is used, then structural strength and adhesion are improved, but weight and thickness increase
Solution Approach 1:
The patent removes the separate buffer layer from the traditional touch panel structure, integrating its functions into the thin film layer. This extraction of unnecessary components reduces weight and thickness while maintaining the essential buffering function through the optimized thin film layer design with appropriate material selection and thickness control.
Solution Approach 2:
The thin film layer is designed to perform multiple functions simultaneously: it serves as both the buffer layer (absorbing stress and preventing erosion) and the adhesive bonding layer (providing strong adhesion between cover plate and sensing layer). This multi-functionality eliminates the need for separate buffer and adhesive layers, reducing overall panel weight and thickness.
2Stress or pressure
If a traditional multi-layer structure with separate buffer layer is used, then stress buffering is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the buffer layer and adhesive layer into a single integrated thin film layer. This layer combines the stress-buffering properties of buffer materials with the adhesive properties of bonding materials, providing both stress absorption and strong adhesion functions simultaneously. The merging reduces the number of layers from four (cover plate, buffer layer, adhesive layer, sensing layer) to three, simplifying the overall structure.
Solution Approach 2:
The thin film layer uses composite material composition, combining materials with different properties (buffering characteristics and adhesive characteristics) into a single functional layer. This composite approach allows the layer to provide both stress buffering and adhesion functions, reducing structural complexity while maintaining performance.
3Ease of manufacture
If the sensing layer is positioned on the same side as the thin film layer adhering to the cover plate, then manufacturing is simplified, but adhesion flatness and optical quality deteriorate
Solution Approach 1:
The patent inverts the conventional layer arrangement by positioning the sensing layer on the opposite side of the thin film layer from the cover plate. Instead of having the sensing layer adjacent to the cover plate (which would compromise adhesion flatness), the sensing layer is placed on the rear side of the thin film layer. This inversion resolves the conflict by maintaining good adhesion flatness between the cover plate and thin film layer while still allowing the sensing layer to function properly through the transparent thin film layer.
4Productivity
If direct bonding between thin film layer and sensing layer is used, then manufacturing steps are reduced, but erosion and damage during sensing layer formation increase
Solution Approach 1:
The patent introduces the thin film layer as an intermediary between the cover plate and the sensing layer. This intermediary layer protects the sensing layer from erosion and damage during the sensing layer formation process by providing a protective barrier. The thin film layer absorbs the harmful effects of the formation process while maintaining strong adhesion to both the cover plate and sensing layer, ensuring the integrity of the sensing layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a touch panel that is lighter, thinner, and more cost-effective, with improved optical properties and reduced mechanical stress, leading to enhanced durability and visual appearance.
Implementation Method 1
the characteristic differences between the thin film layer and the sensing layer, such as the difference of refractive index and the difference of coefficient of thermal expansion
Implementation Method 2
the difference of refractive index and the difference of coefficient of thermal expansion, between the thin film layer and the sensing layer
Implementation Method 3
The bonding layer is located between the cover plate and the thin film layer
Implementation Method 4
the erosion to the thin film layer in the process of forming the sensing layer can be reduced
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 1E-1
AI summary
A touch panel includes a cover plate, a thin film layer, a buffer layer, a sensing layer and a bonding layer. The bonding layer is located between the cover plate and the thin film layer. The thin film layer is located between the bonding layer and the buffer layer. The buffer layer is located between the sensing layer and the thin film layer.