Thin-Film Touch Panel Transfer Structure for Stress Control
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Solution Overview
Problem
Current touch panels face challenges in achieving a thinner, lighter, and cost-effective structure while maintaining desirable appearance and performance, particularly in meeting the demands of modern consumer electronics.
Innovation Solution
A manufacturing method for touch panels involving a film layer, buffer layer, and sensing layer, with a cover and binding layer, where a first plate provides mechanical support and is later removed, and a second plate facilitates the transfer of the film and sensing layers to the cover, incorporating a buffer layer to mitigate stress and optical differences between layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If traditional touch panel manufacturing methods are used, then structural strength and stability are maintained, but the touch panel becomes thicker and heavier with higher production costs
Solution Approach 1:
The patent replaces traditional thick glass substrates with thin film layers (including buffer layer, sensing layer, and cover layer) to reduce weight and thickness. The flexible film structures maintain structural integrity while achieving the desired thinness, directly addressing the contradiction between weight reduction and strength maintenance.
Solution Approach 2:
The patent employs composite material structures consisting of multiple functional layers (buffer layer, sensing layer, cover layer, binding layer) bonded together. This composite approach provides both the weight reduction needed for thinness and the structural strength required for durability, resolving the contradiction between these two parameters.
2Length of moving object
If traditional manufacturing processes are used, then production stability is maintained, but production costs increase and thickness reduction is limited
Solution Approach 1:
The patent divides the touch panel into separate functional layers (buffer layer, sensing layer, cover layer, binding layer) that can be manufactured and assembled independently. This segmentation enables precise thickness control of each layer while simplifying the overall manufacturing process and reducing costs.
Solution Approach 2:
The patent applies binding layers and buffer layers in advance during the manufacturing process to facilitate subsequent assembly steps and ensure proper adhesion between layers. This preliminary action simplifies the overall manufacturing process while enabling thinness and cost-effectiveness.
3Length of moving object
If thin film layers are used to reduce thickness, then the touch panel becomes thinner and lighter, but stress and damage during manufacturing increase
Solution Approach 1:
The patent introduces buffer layers between thin film structures and substrates to cushion and absorb stress during manufacturing processes. This beforehand cushioning protects the thin film layers from damage while enabling the desired thinness, directly resolving the contradiction between thickness reduction and manufacturing reliability.
Solution Approach 2:
The patent uses binding layers as intermediary elements between different thin film layers and substrates. These intermediary layers provide stress distribution and adhesion, protecting the thin film structures from damage during manufacturing while enabling the overall thinness of the touch panel.
4Adaptability or versatility
If multiple layers are added to improve performance, then functionality is enhanced, but optical properties and appearance deteriorate due to stress and refractive index differences
Solution Approach 1:
The patent carefully selects and adjusts the refractive index parameters of each layer (buffer layer, sensing layer, cover layer) to minimize optical interference and maximize light transmission. This parameter optimization enables multiple functional layers to coexist without degrading optical properties, resolving the contradiction between functionality enhancement and optical performance maintenance.
Data Source
AI summary
A touch panel is formed by firstly forming a film layer on a first plate, and next, sequentially forming a buffer layer on the film layer, forming a sensing layer on the buffer layer, forming a second plate on the sensing layer. After the foregoing formation procedures, the first plate is removed from the film layer. Next, a cover is attached to the film layer. In this way, the film layer is located between the cover and the buffer layer. Finally, the second plate is removed from the sensing layer, so as to form a touch panel with the features of light weight, thin thickness and low costs.