Touch Panel Wire-Switching Layout for Narrow-Bezel Encapsulation
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Solution Overview
Problem
Conventional touch panels face issues with encapsulation failure due to inorganic materials remaining in wire-switching holes, affecting signal transmission and touch performance, especially in narrow frame designs.
Innovation Solution
A touch panel structure with a signal trace layer, encapsulation layer, and inorganic layer stacked on a substrate, featuring barrier walls and wire-switching holes to expose signal traces, ensuring the touch layer laps with the traces, and a layered encapsulation design to prevent material accumulation in the holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the distance between the chemical vapor deposition border and the wire-switching hole is increased to prevent inorganic material accumulation, then the encapsulation effectiveness is improved, but the lower frame width increases
Solution Approach 1:
The encapsulation layer is divided into two distinct parts: a first encapsulation layer that extends to the chemical vapor deposition border, and a second encapsulation layer that fills the wire-switching holes and extends to the bending area. This segmentation allows each layer to perform its specific function - the first layer provides general encapsulation while the second layer specifically addresses material accumulation in the wire-switching holes, thereby maintaining narrow frame width while ensuring encapsulation effectiveness.
Solution Approach 2:
Different regions of the encapsulation structure are assigned different properties and functions. The first encapsulation layer provides baseline protection across the entire panel, while the second encapsulation layer is specifically designed to fill and seal the wire-switching holes where inorganic material accumulation occurs. This local differentiation of quality and function allows the structure to address the specific problem at the wire-switching holes without requiring increased distance from the chemical vapor deposition border.
2Length of stationary object
If the lower frame width is reduced for narrow frame design, then the device compactness is improved, but inorganic materials accumulate in the wire-switching holes affecting signal transmission
Solution Approach 1:
The second encapsulation layer is specifically extracted and applied to the wire-switching hole regions to remove or prevent the harmful accumulation of inorganic materials. This targeted extraction of the encapsulation function to specific problem areas allows the narrow frame design to be maintained while ensuring that signal transmission is not blocked by material accumulation in the wire-switching holes.
3Device complexity
If a single encapsulation layer is used to simplify the structure, then the manufacturing process is simplified, but inorganic material accumulation cannot be prevented in the wire-switching holes
Solution Approach 1:
The encapsulation layer is segmented into two distinct layers with different functions and extension ranges. The first encapsulation layer provides general encapsulation coverage, while the second encapsulation layer specifically targets the wire-switching holes to prevent inorganic material accumulation. This segmentation resolves the contradiction by maintaining structural simplicity through a systematic two-layer approach while achieving the reliability needed to prevent material accumulation.
Solution Approach 2:
The first encapsulation layer is formed first to provide a base encapsulation structure, and then the second encapsulation layer is formed to specifically address the wire-switching hole regions. This preliminary action of forming the first layer creates a foundation that simplifies the subsequent formation of the second layer, as the second layer can be deposited on top of the existing first layer structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure reduces the lower frame width and enhances encapsulation effectiveness by preventing inorganic material buildup in wire-switching holes, ensuring reliable signal transmission and improved touch performance.
Implementation Method 1
film thickness of chemical vapor deposition (CVD) will gradually decrease along the border
Data Source
AI summary
The present disclosure provides a touch panel and a method for manufacturing the same, and an electronic device. The touch panel includes a display area and a non-display area. The non-display area includes a bending area and a wire-switching area. By disposing an edge of the inorganic layer between the display area and the wire-switching area, disposing an edge of the encapsulation layer between an edge of the inorganic layer and the bending area, and disposing a plurality of wire-switching holes in the wire-switching area, so that signal traces are exposed by the wire-switching holes, thus preventing materials of the encapsulation layer from remaining in the wire-switching holes.