Touch Screen Disassembly Device with Adhesive Processing Mechanism
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Solution Overview
Problem
The challenge lies in disassembling touch screen devices without damaging the display panel and the cover, as existing methods fail to efficiently separate these components during the manufacturing process of defective products.
Innovation Solution
A disassembly device featuring oppositely arranged fixture mechanisms and an adhesive processing mechanism that reduces adhesive force through cooling, heating, or solvent treatment, allowing for safe separation of substrates without damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If traditional disassembly methods are used to separate the display panel and cover, then the components can be separated, but the display panel and cover are damaged in the process
Solution Approach 1:
The adhesive is processed (heated, cooled, or treated with solvent) before the disassembly action is performed. This preliminary treatment reduces the adhesive force, allowing the substrates to be separated without damage. The fixture mechanisms are also positioned and activated before the actual separation occurs.
Solution Approach 2:
The adhesive processing mechanism changes the physical or chemical parameters of the adhesive (temperature, state, or composition) to reduce its bonding strength. Heating transforms the adhesive from solid to colloidal state, cooling causes volume shrinkage, or solvents dissolve the adhesive, all of which reduce adhesive force and enable damage-free separation.
2Reliability
If the adhesive force is not reduced, then the substrates remain firmly bonded, but the substrates cannot be separated without damage
Solution Approach 1:
The adhesive processing mechanism changes the physical or chemical parameters of the adhesive to reduce bonding strength. Heating transforms the adhesive from solid to colloidal state, cooling causes volume shrinkage, or solvents dissolve the adhesive, all of which reduce adhesive force and enable damage-free separation.
Solution Approach 2:
A solvent is introduced as an intermediary substance between the adhesive and substrates. The solvent dissolves or weakens the adhesive, acting as a mediator that reduces the bonding force without directly contacting or damaging the substrates themselves.
3Device complexity
If the fixture mechanisms are not used, then the disassembly process is simpler, but the substrates cannot be held securely during separation
Solution Approach 1:
The fixture mechanisms use suction cups that operate on pneumatic principles to hold the substrates. The suction cups create a vacuum or pressure differential that securely attaches to the substrate surfaces, providing reliable fixing without complex mechanical clamps or fasteners.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device efficiently disassembles touch screen components by reducing adhesive force, enabling separation of substrates without damage, thus addressing the challenge of disassembling touch screens without causing harm to the display panel or cover.
Implementation Method 1
the fixture mechanism comprises a housing and suction cups disposed on the housing, and the suction cups are able to adsorb the first substrate and the second substrate
Implementation Method 2
the adhesive processing mechanism is able to perform a cooling treatment on the adhesive, such that the adhesive is subjected to volume shrinkage
Implementation Method 3
the adhesive processing mechanism comprises a heating element for heating the adhesive
Implementation Method 4
the preset temperature is the temperature at which the adhesive is transformed from the solid state to the colloidal state
Implementation Method 5
one or more solvent containers in which solvent capable of dissolving the adhesive is provided
Data Source
AI summary
Disclosed is disassembly device for disassembling component such as touch display screen, the component comprising a first substrate and substrates which are arranged oppositely and between which adhesive is provided. The device comprises oppositely arranged two fixture mechanisms which fix the first substrate and the second substrate, respectively, and which can relatively move close to or away from each other. The device further comprises an adhesive processing mechanism, such that an adhesive force between the adhesive after processing and the first (and/or second) substrate is less than the adhesive force between the adhesive before processing and the first (and/or second) substrate. With the disassembly device according to the embodiments of the disclosure, the mutually attached first substrate and second substrate can be efficiently disassembled without damaging the first substrate and the second substrate.