Touch Screen Layer Reduction via Display and Battery Integration

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Solution Overview

Problem

The integration of touch-sensitive input devices in electronic devices increases complexity, bulk, and manufacturing costs due to the need for additional layers and substrates, making it challenging to achieve compact form factors.

Innovation Solution

The implementation of a touch screen with a reduced number of layers using a crosspoint array formed by two integrated packages, where one layer is integrated into the display and the other into the battery pack, eliminating the need for a dedicated crosspoint array component and substrate, thereby simplifying assembly and reducing device thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional touch-sensitive input devices are integrated into electronic devices, then touch functionality is achieved, but device thickness and complexity increase

Engineering Contradiction:
Improvetouch functionalityVSAvoiddevice thickness
Core Design Contradiction:
Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The patent merges the touch sensor layers with existing device components (display and battery pack) by integrating conductive traces directly into these components. This eliminates the need for separate touch sensor substrates and reduces overall device thickness while maintaining touch functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The display and battery pack components are given dual functionality: they serve their primary purposes (displaying information and providing power) while also acting as substrates for the touch sensor array. This multi-functionality eliminates the need for dedicated touch sensor layers, reducing device thickness.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If traditional touch-sensitive input devices are integrated into electronic devices, then touch functionality is achieved, but manufacturing complexity increases

Engineering Contradiction:
Improvetouch functionalityVSAvoidassembly complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple functions into fewer components by integrating touch sensor traces into the display and battery pack. This reduces the total number of separate components and assembly steps, thereby reducing manufacturing complexity.

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If additional layers and substrates are added for touch functionality, then touch sensitivity is improved, but device thickness increases

Engineering Contradiction:
Improvetouch sensitivityVSAvoiddevice thickness
Core Design Contradiction:
Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

Existing structural components (display and battery pack) are made multi-functional by incorporating touch sensor traces into them. This eliminates the need for additional dedicated touch sensor layers, achieving touch sensitivity without increasing device thickness.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS8345073B1Touch screen layer reduction
Publication Date: 2013.01.01 AMAZON TECH INC
  • US8345073B1 patent drawing
  • US8345073B1 patent drawing
  • US8345073B1 patent drawing

AI summary

Layers of a touch sensor array used by electronic devices may be incorporated into other components, such that a touch sensor array is formed upon assembly of the other components. This touch sensor array may then be used as an input device by a user. For example, one layer of a touch sensor array may be integrated into the back of a display component, forming a first integrated package. Similarly, a second layer of the touch sensor array may be integrated into the front of a battery, forming a second integrated package. Upon assembly of the display atop the battery, the touch sensor array is formed. Such integration results in simpler and less expensive assembly, reduces the count of discrete parts during assembly, and minimizes the electronic device's physical profile.