Touch Screen Panel Polymer Layer Infiltration

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Solution Overview

Problem

Conventional touch screen panel manufacturing methods are complex and costly due to the need for multiple masking processes and the formation of interfaces between heterogeneous materials, which can lead to stress and reduced mechanical flexibility in the final product.

Innovation Solution

The use of sequential vapor infiltration (SVI) to infiltrate conductive or dielectric materials into polymer layers within the touch screen panel, creating an organic-inorganic composite with improved conductivity or insulating properties while maintaining mechanical flexibility, and reducing the number of masks required in the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple masking processes are used to form conductive and insulating patterns, then manufacturing precision is improved, but device complexity and manufacturing cost increase

Engineering Contradiction:
Improvepattern formation precisionVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines multiple masking processes into a single masking step by using a dual-functional polymer layer that can be selectively removed to form both conductive patterns and insulating patterns. This merging reduces the number of separate masking operations required in conventional manufacturing processes.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The polymer layer serves multiple functions: it acts as a masking layer, a source of conductive material (through infiltration), and a precursor for insulating patterns. This multi-functionality eliminates the need for separate masking layers and reduces the overall number of process steps.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If multiple heterogeneous material interfaces are formed, then functional properties are improved, but mechanical flexibility deteriorates due to stress

Engineering Contradiction:
Improveelectrical functional performanceVSAvoidmechanical flexibility
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent creates an organic-inorganic composite structure where inorganic conductive materials (such as metal nanoparticles or conductive oxides) are embedded within an organic polymer matrix. This composite approach maintains the electrical functionality of inorganic materials while benefiting from the mechanical flexibility of the polymer base, reducing interfacial stress between heterogeneous materials.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The polymer layer is designed with controlled porosity to allow infiltration of conductive materials while maintaining structural integrity. The porous structure enables uniform distribution of conductive fillers, creating effective electrical pathways without forming rigid interfaces that would compromise mechanical flexibility.

Inventive Principle:
Principle #31Porous materials

3Manufacturing precision

If conventional masking processes are used, then manufacturing precision is improved, but productivity decreases due to process time

Engineering Contradiction:
Improvepattern accuracyVSAvoidmanufacturing throughput
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

Multiple sequential masking operations are merged into a single masking and infiltration process. The polymer layer is patterned once, then conductive materials are infiltrated in a single batch process, eliminating the need for repeated masking, deposition, and etching cycles required in conventional approaches.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The polymer layer is pre-patterned with the desired conductive and insulating regions before material infiltration. This preliminary structuring allows subsequent infiltration processes to proceed in a single step without requiring multiple alignment and deposition operations, significantly reducing total process time.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the manufacturing process, reduces costs, and enhances the mechanical flexibility and performance of the touch screen panel by eliminating interfaces between heterogeneous materials and providing stable organic-inorganic composite layers with desired electrical properties.

Implementation Method 1

The use of sequential vapor infiltration (SVI) to infiltrate conductive or dielectric materials into polymer layers within the touch screen panel

Methodology Applied
Scientific EffectSequential vapor infiltration: Physical Vapour Deposition

Implementation Method 2

The conductive material or the dielectric material may be chemically adsorbed to a surface of a free volume disposed in the first or second polymer layer, respectively

Methodology Applied
Scientific EffectChemical adsorption: Chemisorption

Data Source

PatentUS9880686B2Touch screen panel, display device, and manufacturing method thereof
Publication Date: 2018.01.30 SAMSUNG DISPLAY CO LTD
  • US9880686B2 patent drawing
  • US9880686B2 patent drawing
  • US9880686B2 patent drawing

AI summary

A touch screen panel includes first electrode patterns disposed in a first direction, first connection patterns electrically connecting the first electrode patterns, second electrode patterns disposed in a second direction intersecting the first direction and insulated from the first electrode patterns, insulating patterns disposed on the first connection patterns, and second connection patterns disposed on the insulating patterns and electrically connecting the second electrode patterns, in which at least one of the first electrode patterns, the first connection patterns, the second electrode patterns, and the second connection patterns include a first polymer layer including a conductive material infiltrated therein, and the insulating patterns comprise a second polymer layer comprising a dielectric material infiltrated therein.