Touch Sensing Layer Structure to Prevent Insulating Layer Cracks

The patent applies parameter changes by optimizing the thickness of the insulating layer to specific ranges (first insulating layer: 150-300 nm, second insulating layer: 200-400 nm) to prevent cracking while maintaining manufacturing feasibility. This quantitative parameter optimization resolves the contradiction between reliability improvement and device complexity increase.

The insulating layer is segmented into multiple sub-layers (first insulating layer 122, second insulating layer 124) with different thicknesses and material compositions. This segmentation allows each layer to fulfill specific functional requirements, improving overall reliability while distributing the complexity across manageable components.

The patent optimizes the thickness parameters of conductive patterns to specific ranges (first conductive pattern: 50-200 nm, second conductive pattern: 100-300 nm) to achieve adequate conductivity while maintaining manufacturing precision. These parameter optimizations balance electrical performance with fabrication capabilities.

The conductive patterns utilize composite material structures with specific material compositions that provide adequate conductivity at reduced thicknesses, thereby lowering manufacturing precision requirements while maintaining electrical performance.