Touch-Sensing LCD Panel Low-Temperature Baking for Sheet Resistance

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Solution Overview

Problem

Existing touch-sensing liquid crystal panels face performance limitations due to high sheet resistance in their sensing matrices, requiring more power for operation and hindering convenience in touch-sensing applications.

Innovation Solution

A touch-sensing liquid crystal panel is fabricated using low temperature baking technology to form a sensing matrix with indium tin oxide (ITO) having a sheet resistance of 30 ohm/square or less, combined with a color filter substrate and transistor substrate, and a liquid crystal layer, to enhance touch-sensing performance while reducing thickness and weight.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If conventional touch-sensing matrix with higher sheet resistance is used, then manufacturing cost is reduced, but power consumption increases and touch-sensing performance deteriorates

Engineering Contradiction:
Improvepower consumptionVSAvoidtouch-sensing performance
Core Design Contradiction:
Use of energy by moving objectVSReliability

Solution Approach 1:

The patent applies parameter changes by optimizing the sheet resistance of the sensing matrix to a specific range (15-30 ohm/square) and controlling the thickness of the sensing matrix (1000-1400 Angstrom). These parameter adjustments resolve the contradiction by achieving lower power consumption while maintaining reliable touch-sensing performance.

Inventive Principle:
Principle #35Parameter changes

2Use of energy by moving object

If sensing matrix thickness is increased to reduce sheet resistance, then power consumption decreases, but panel thickness increases

Engineering Contradiction:
Improvepower consumptionVSAvoidpanel thickness
Core Design Contradiction:
Use of energy by moving objectVSLength of moving object

Solution Approach 1:

The patent resolves this contradiction by precisely controlling the sensing matrix thickness within the range of 1000-1400 Angstrom. This parameter optimization achieves the dual benefit of reducing sheet resistance (lowering power consumption) while maintaining the thin profile of the display panel.

Inventive Principle:
Principle #35Parameter changes

3Use of energy by moving object

If low temperature baking technology is applied to reduce sheet resistance, then power consumption decreases, but manufacturing process complexity increases

Engineering Contradiction:
Improvepower consumptionVSAvoidfabrication process
Core Design Contradiction:
Use of energy by moving objectVSEase of manufacture

Solution Approach 1:

The patent applies low temperature baking technology with optimized time and temperature parameters to reduce the sheet resistance of the sensing matrix to 15-30 ohm/square. This parameter-optimized process achieves lower power consumption while maintaining ease of manufacture through simplified fabrication steps.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution results in a touch-sensing liquid crystal panel with improved performance, reduced power consumption, and a thinner, lighter design, addressing the limitations of high sheet resistance in existing panels.

Implementation Method 1

The fabrication method uses low temperature baking technology to form a sensing matrix with lower electrical resistance

Methodology Applied
Scientific EffectLow temperature baking: Heat Treatment

Data Source

PatentUS9046707B2Touch-sensing liquid crystal panel and fabrication method thereof
Publication Date: 2015.06.02 HANNSTAR DISPLAY CORP
  • US9046707B2 patent drawing
  • US9046707B2 patent drawing
  • US9046707B2 patent drawing

AI summary

A touch-sensing liquid crystal panel and a fabrication method thereof are provided. The touch-sensing liquid crystal panel includes a color filter substrate, a transistor substrate, and a sensing matrix. In the fabrication method, at first, a first glass substrate is provided. Then, color filters and a common electrode are disposed on a first surface of the first glass substrate to form a color filter substrate. Thereafter, a transistor substrate is combined with the color filter substrate. Then, the glass substrates of the color filter substrate and the transistor substrate are slimed. Thereafter, a sensing layer is formed on a second surface of the first glass substrate, wherein the second surface is opposite to the first surface. Then, the sensing layer is baked to enable a sheet resistance of the sensing matrix to be equal to or less than 30 ohm/square. Thereafter, the sensing layer is patterned.