Touch-Sensitive Module with Segmented Sensor Pads and Wire Bonding
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Solution Overview
Problem
The increasing complexity of coupling between touch-sensitive modules and circuits in control devices complicates the manufacturing process and requires a simpler and more efficient method for producing touch-sensitive modules with gesture sensing/touch sensing functions.
Innovation Solution
A touch-sensitive module design featuring a first and second sensor pad with a wrapper, where the sensor pads are connected via leads and a wire bonding process, allowing for easy integration and manufacturing through metal stamping and injection molding, enabling flexible and modular design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the quantity of touch-sensitive modules increases to achieve more data input functions, then the control functionality is enhanced, but the coupling between modules and circuits becomes more complicated
Solution Approach 1:
The touch-sensitive module is divided into separate functional components: sensor pads for data input, leads for electrical connection, and a wrapper for protection. This segmentation allows each component to be optimized independently and simplifies the overall coupling with control circuits.
Solution Approach 2:
The wrapper serves multiple functions simultaneously: it protects the sensor pads and leads, provides structural support, and facilitates mounting to the control device. This multi-functionality reduces the need for additional components, simplifying the overall system.
2Adaptability or versatility
If the coupling between touch-sensitive modules and circuits becomes more complicated, then more functions are achieved, but the manufacturing process becomes more difficult
Solution Approach 1:
The sensor pads and leads are pre-assembled into an integrated module with the wrapper before being mounted to the control device. This preliminary assembly simplifies the final manufacturing step, as the module can be installed as a complete unit rather than assembling multiple separate components on the control device.
Solution Approach 2:
The sensor pads and leads are combined into a single integrated assembly that functions as one module. This merging reduces the number of separate manufacturing steps and simplifies the coupling process with the control device circuits.
3Adaptability or versatility
If more touch-sensitive modules are used, then gesture sensing capability is enhanced, but the size of control devices increases
Solution Approach 1:
The wrapper is designed as a thin protective structure that encloses the sensor pads and leads without adding significant volume. This thin-film approach allows multiple modules to be integrated into compact control devices while maintaining gesture sensing capability.
Solution Approach 2:
The sensor pads are arranged in a compact configuration within the wrapper, with leads extending from the assembly in an space-efficient manner. This nested arrangement allows multiple modules to be closely integrated, minimizing the overall control device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing process, reduces the size of control devices, and allows for flexible application in various devices, enhancing the ease of integration and functionality of touch-sensitive modules.
Implementation Method 1
The wire is electrically connected to the first portion and the second portion of the second sensor pad via wire bonding
Implementation Method 2
the first sensor pad, the second sensor pad, the first lead, the second lead, the third lead and the fourth lead form a planner structure and are integrally formed with a main frame by a metal stamping process
Implementation Method 3
the wrapper is formed by injection molding and cutting process to expose portions of the first lead, the second lead, the third lead and the fourth lead
Data Source
AI summary
A touch-sensitive module is provided. The touch-sensitive module includes at least one first sub-unit. The first sub-unit includes a first sensor pad, a second sensor pad and a wrapper. The second sensor pad has a first portion and a second portion separated from each other. The first sensor pad passes through a gap between the first portion and the second portion of the second sensor pad. Two ends of a wire are electrically connected to the first portion and the second portion of the second sensor pad, respectively. The wrapper covers the first sensor pad and the second sensor pad. A first lead and a second lead connected to the first sensor pad protrude from the wrapper. A third lead and a fourth lead connected to the second sensor pad protrude from the wrapper.