Touch Sensor Module Bending Area Stress Distribution
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Solution Overview
Problem
Existing touch sensor modules face challenges in maintaining electrical and mechanical reliability, especially when subjected to bending or folding, which can lead to delamination and damage to sensing electrodes and traces in flexible display devices.
Innovation Solution
A touch sensor module design featuring a supporting structure with an adhesive material, a flexible circuit board, and an optical layer that covers the bending area, preventing delamination and damage by distributing stress and maintaining electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the touch sensor module is made flexible to enable bending, then adaptability is improved, but mechanical reliability deteriorates due to delamination and damage to sensing electrodes and traces
Solution Approach 1:
The patent employs flexible thin film structures for the touch sensor module, including flexible substrates and thin film electrodes that can withstand bending while maintaining structural integrity. The flexible circuit board uses thin film conductors and insulators that resist delamination during flexing, directly addressing the mechanical reliability issue while preserving flexibility.
Solution Approach 2:
The patent utilizes composite material structures combining multiple layers with different mechanical properties. The flexible substrate combines polymer materials with varying moduli to distribute bending stresses, while the adhesive layers use composite formulations that maintain strong bonding during flexing. This composite approach prevents delamination and protects sensing electrodes from damage while maintaining the module's flexibility.
2Adaptability or versatility
If the touch sensor module is made flexible to enable bending, then adaptability is improved, but electrical reliability deteriorates due to damage to sensing electrodes and traces
Solution Approach 1:
The patent employs flexible thin film structures for the touch sensor module, including flexible substrates and thin film electrodes that can withstand bending while maintaining structural integrity. The flexible circuit board uses thin film conductors and insulators that resist delamination during flexing, directly addressing the mechanical reliability issue while preserving flexibility.
Solution Approach 2:
The patent modifies material parameters such as the flexibility and conductivity of electrode materials to maintain electrical performance during bending. The sensing electrodes use materials with appropriate elastic modulus and electrical conductivity that remain stable under flexing conditions, preventing electrical failure while enabling the flexible form factor.
3Reliability
If a supporting structure is added to protect the bending area, then mechanical reliability is improved, but device complexity increases
Solution Approach 1:
The patent integrates the supporting structure with existing components of the touch sensor module. The flexible substrate itself serves as a supporting element, and additional support layers are combined with the adhesive and electrode structures rather than being separate additions. This merging approach provides mechanical protection during bending while minimizing increases in overall device complexity.
Solution Approach 2:
The supporting structure in the patent serves multiple functions: it provides mechanical strength during bending, acts as an adhesive substrate for mounting components, and serves as a protective layer for the sensing electrodes. This multi-functionality reduces the need for separate protective components, thereby limiting the increase in device complexity while improving mechanical reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances mechanical and electrical stability, preventing delamination and damage to the touch sensor module during bending, ensuring reliable operation even in flexible display devices with significant bending radii.
Implementation Method 1
the supporting layer includes an adhesive material
Data Source
AI summary
A touch sensor module according to an embodiment of the present invention includes a touch sensor layer including a visual area, a bending area and a pad area, a flexible circuit board electrically connected to the touch sensor layer on the pad area of the touch sensor layer, supporting structure covering the touch sensor layer on the bending area, and an optical layer disposed on the visual area of the touch sensor layer. The optical layer partially covers the supporting structure on a portion of the bending area adjacent to the visual area.


