Touch Sensor Fine Metal Wire Composite Structure for Moire Suppression
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Solution Overview
Problem
Conductive films used in touch sensors, such as those in touch panels, face challenges in achieving rub resistance, bending properties, and preventing moire occurrence, as described in existing technologies like JP2022-120829A.
Innovation Solution
A touch sensor design featuring a transparent substrate with a mesh pattern of fine metal wires, where the fine metal wire includes a layer to be plated with an organic component, having a specific average line width and height ratio, and a convex shape in cross-section, which enhances rub resistance and bending properties while suppressing moire occurrence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a fine metal wire with small line width is used to suppress moire occurrence, then moire is suppressed, but the wire becomes more susceptible to damage during bending and rubbing
Solution Approach 1:
The fine metal wire is constructed as a composite structure with a metal core layer providing mechanical strength and an organic plating layer providing flexibility and damage resistance. This composite material approach allows the wire to maintain both thin dimensions for moire suppression and sufficient durability for bending and rubbing resistance.
Solution Approach 2:
The invention optimizes the line width parameter to a specific range (1 to 2.5 μm) that balances moire suppression with adequate mechanical strength. Additionally, the ratio of metal layer to organic layer is controlled within 1.25 to 1.6, and the organic layer height is controlled at 0.5 to 2.0 μm, creating optimal parameters for both visual performance and mechanical reliability.
2Object-affected harmful factors
If the fine metal wire line width is reduced to suppress moire, then moire occurrence is suppressed, but rub resistance deteriorates
Solution Approach 1:
The organic plating layer is applied over the metal core to create a composite structure where the organic material provides enhanced rub resistance while the metal core maintains electrical conductivity. This composite approach enables the thin wire structure to achieve sufficient surface hardness and wear resistance despite the reduced overall line width.
Solution Approach 2:
The wire structure is designed with different layers having different properties: the metal core provides strength and conductivity, while the organic plating layer provides rub resistance and flexibility. This local differentiation of material properties allows the wire to simultaneously achieve thin dimensions for moire suppression and sufficient surface durability for rub resistance.
3Object-affected harmful factors
If the fine metal wire is made thinner to suppress moire, then moire occurrence is suppressed, but bending properties worsen due to increased susceptibility to damage
Solution Approach 1:
The organic plating layer envelops the metal core in a composite structure that provides both flexibility for bending and protection against damage. The organic material's inherent flexibility allows the thin wire to bend without breaking, while its protective nature prevents damage during bending operations.
Solution Approach 2:
The invention controls the organic layer height (0.5 to 2.0 μm) and the metal-to-organic layer ratio (1.25 to 1.6) to optimize the balance between flexibility and strength. These parameter optimizations ensure that the thin wire structure maintains adequate bending durability while suppressing moire occurrence.
Data Source
AI summary
A touch sensor satisfies three characteristics of rub resistance, bending properties, and suppression of occurrence of a moire. The touch sensor includes a transparent substrate having a display region and a non-display region and a fine metal wire disposed in the display region. A mesh pattern is composed of fine metal wires, and the fine metal wire includes a layer to be plated and a metal layer formed on the layer to be plated in this order from a transparent substrate side. The layer to be plated is a convex shape and includes an organic component as a main component, the fine metal wire has an average line width of 1 to 2.5 μm, and a ratio of the average line width of the fine metal wires to an average line width of layers to be plated is 1.25 to 1.6.


