Touch Sensor Arrays with Inter-Layer Contacts
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Solution Overview
Problem
Conventional screen printing techniques for forming touch sensor arrays result in bulky devices due to undesirably large interconnect patterns and layouts, which occupy excessive space.
Innovation Solution
The formation of touch sensor arrays using patterned conductive structures on substrates with interconnect line segments connected in rectangular contact regions, where an insulator layer is strategically removed to allow direct contact between upper and lower ink layer structures, minimizing space usage and optimizing layout efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional screen printing techniques are used to form interconnect patterns, then the touch sensor array can be manufactured with standard processes, but the resulting device becomes bulky due to excessively large interconnect patterns occupying excessive space
Solution Approach 1:
The patent transitions from planar 2D interconnect routing to 3D multi-layer routing by adding vertical dimension through additional ink layers. Interconnect lines are distributed across multiple layers with through-substrate vias enabling vertical connections, allowing compact routing that reduces the footprint area while maintaining manufacturability through extended process dimensions
Solution Approach 2:
The patent implements nested routing where interconnect lines on different layers are vertically stacked and connected through vias, creating a nested 3D structure. This allows multiple signal paths to occupy overlapping horizontal space at different vertical levels, significantly reducing the area required for interconnect patterns while preserving ease of manufacture through systematic layering
2Area of stationary object
If interconnect patterns are reduced in size to minimize device area, then the touch sensor array becomes more compact, but the manufacturing precision requirements increase
Solution Approach 1:
The patent segments the interconnect routing into multiple discrete layers, with each layer containing specific interconnect lines and contact pads. This segmentation allows independent optimization of each layer's pattern size and spacing, reducing the overall device area while maintaining relaxed manufacturing precision requirements through distributed routing across multiple manageable segments
Solution Approach 2:
The patent introduces through-substrate vias as intermediary elements that connect interconnect lines between layers. These vias serve as precise registration features that facilitate alignment between layers, enabling compact interconnect patterns with reduced area while maintaining manufacturing precision through the intermediary alignment function of the via structures
Data Source
AI summary
Touch pad structures are provided that gather touch sensor data. The data may be used to control a computer or other electronic device. The touch pad structures may be integrated into a computer or other computing equipment or may be provided as a stand-alone accessory. The touch pad structures may include a touch sensor array. The touch sensor array may include rows and columns of touch sensor electrodes, interconnect lines, and other conductive structures. The conductive structures on the touch sensor array may be formed from patterned layers of ink. Interconnect line segments in different layer of ink may be connected in rectangular contact regions. The touch sensor array may have a tail. A layer of insulator may be removed from the substrate across a tip portion of the tail to allow the line segments to be connected.