Touch Sensor Nanowire Silver Composite Narrow Bezel Traces

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Solution Overview

Problem

Current touch sensors with silver paste peripheral circuits face challenges in achieving flexibility and stability required for narrow bezel designs, as they often compromise on line width and spacing, leading to increased trace resistance and potential peeling issues during bending.

Innovation Solution

A touch sensor design featuring a metal nanowire layer, transitional insulating portion, and silver layer, where the metal nanowire layer forms electrode and wiring portions with a silver layer stacked on top, providing direct electrical connection without additional overlapping structures, and a manufacturing method that includes etching and surface treatment processes to achieve small line widths and improved stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If silver paste is used as material for peripheral circuits to achieve flexibility, then the touch panel can be bent, but the line width and spacing increase leading to higher trace resistance

Engineering Contradiction:
ImproveflexibilityVSAvoidtrace resistance
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent uses a composite structure combining metal nanowires and silver paste. The metal nanowire layer provides flexible conductivity while the silver paste layer forms the peripheral circuits. This composite approach allows achieving both flexibility and low trace resistance by combining the advantages of both materials - the nanowires enable bending without cracking while the silver paste provides stable electrical connection with controlled resistance.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent employs thin film structures for the peripheral circuits, replacing traditional thick silver paste traces with optimized thin silver layers deposited on metal nanowire patterns. This thin film approach reduces the overall thickness and improves flexibility while maintaining electrical performance through optimized deposition processes and pattern designs.

Inventive Principle:
Principle #30Flexible shells and thin films

2Ease of manufacture

If silver paste is used for peripheral circuits to simplify manufacturing, then the process is easier, but stability during bending deteriorates causing peeling issues

Engineering Contradiction:
Improvemanufacturing processVSAvoidbending stability
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The patent creates a multi-layer composite structure with metal nanowires as the base layer and silver paste as the circuit-forming layer. The nanowire network provides a flexible substrate that prevents the silver paste from peeling during bending, while the silver layer maintains electrical continuity. This composite design solves the peeling issue by distributing mechanical stress across layers with different mechanical properties.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent segments the conductive path into two functional layers: the metal nanowire layer that handles mechanical flexibility and the silver paste layer that provides stable electrical connection. This segmentation allows each layer to optimize its specific function - the nanowires accommodate bending through their network structure while the silver paste maintains stable composition and low resistance.

Inventive Principle:
Principle #1Segmentation

3Area of stationary object

If peripheral circuits are designed in the peripheral area to meet narrow bezel requirements, then the bezel size is reduced, but the available space for circuits is limited

Engineering Contradiction:
Improvebezel sizeVSAvoidcircuit layout
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent uses thin film deposition techniques to create peripheral circuits with minimal thickness, allowing the circuits to occupy reduced space in the peripheral area. The thin film structure enables high-density routing of traces within the constrained bezel area, achieving narrow bezel design while maintaining complete circuit functionality through optimized trace spacing and routing patterns.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent optimizes various parameters including trace width, spacing, and layer thickness to maximize circuit density within the peripheral area. By carefully controlling the thickness of the silver paste layer and the spacing between traces, the design achieves narrow bezel dimensions while maintaining electrical performance and manufacturing feasibility through parameter optimization.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS11762498B1Touch sensor and manufacturing method thereof
Publication Date: 2023.09.19 TPK ADVANCED SOLUTIONS
  • US11762498B1 patent drawing
  • US11762498B1 patent drawing
  • US11762498B1 patent drawing

AI summary

A touch sensor having a visible area and a peripheral area includes a substrate, a metal nanowire layer, a transitional insulating portion, and a silver layer. The metal nanowire layer is disposed on the substrate and defines a plurality of electrode portions corresponding to the visible area and a plurality of wiring portions corresponding to the peripheral area, in which the adjacent wiring portions are spaced apart by a spaced region. The transitional insulating portion is disposed in the spaced region and adjacent and connected to a sidewall of each of the wiring portions, and a gap is between two of the transitional insulating portions that are respectively connected to the adjacent wiring portions. The silver layer is disposed on an upper surface of the wiring portions, and the silver layer and the wiring portions together constitute a plurality of peripheral traces of the touch sensor.