Touch Sensor PCB Routing via Substrate Dimensionality Change
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Solution Overview
Problem
Conventional sensor routing techniques require routing around the borders of touch sensors, leading to increased bezel size, reduced flexibility, higher manufacturing costs, and lower manufacturing yields due to fine trace-widths and reduced panel utilization.
Innovation Solution
The method involves routing first traces in a singular direction between rows of touch sensors on a PCB, electrically coupled using vias, and second traces between columns, eliminating border routing and allowing for flexible PCB designs without increasing the border width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If routing traces around the borders of touch sensors is performed, then the touch sensor can be electrically connected, but the bezel size increases and flexibility is reduced
Solution Approach 1:
The patent transitions from conventional two-dimensional border routing to a three-dimensional solution by routing traces through the substrate thickness dimension. First traces are routed through the substrate in a first direction, and second traces are routed through the substrate in a second direction, allowing electrical connections without border routing and maintaining flexibility.
2Reliability
If routing traces around the borders of touch sensors is performed, then the touch sensor can be electrically connected, but manufacturing costs increase due to fine trace-widths
Solution Approach 1:
By utilizing the substrate thickness dimension for trace routing, the patent eliminates the need for fine border traces. The first and second traces can be routed through the substrate bulk, allowing for standard trace widths and simplifying the manufacturing process while maintaining reliable electrical connections.
3Reliability
If routing traces around the borders of touch sensors is performed, then the touch sensor can be electrically connected, but manufacturing yields are reduced due to fine trace-widths
Solution Approach 1:
The patent routes traces through the substrate thickness rather than along the border edges. This approach uses the third dimension (depth/thickness) to accommodate trace routing, eliminating the need for precision fine trace-widths at the borders and thereby improving manufacturing yield.
4Reliability
If routing traces around the borders of touch sensors is performed, then the touch sensor can be electrically connected, but panel utilization is reduced
Solution Approach 1:
By routing first traces and second traces through the substrate thickness dimension, the patent eliminates the need for border routing that would consume panel area. This allows for more efficient use of the available panel space and improves overall panel utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances flexibility, reduces manufacturing costs, and improves yields by eliminating edge routing, enabling more efficient production of flexible and borderless touch sensor PCBs suitable for various applications.
Implementation Method 1
first traces that are electrically coupled to respective rows of an array of touch sensors between respective second traces that are electrically coupled to respective columns of the array
Data Source
AI summary
A method for improving flexibility of a circuit board, e.g., comprising a touch-based sensor, and reducing manufacturing costs by eliminating routing around a border of the touch-based sensor is presented herein. The method comprises forming an array of touch sensors on a first side of the circuit board, in which portions of the circuit board located between three edges of the circuit board and a border of the array of touch sensors exclude traces; and forming first traces between respective second traces in a singular direction on a second side of the circuit board, in which the first traces are electrically coupled, using a first group of vias, to respective rows of the array of touch sensors, and the second traces are electrically coupled, using a second group of vias, to respective columns of the array of touch sensors.