Touch Sensor Peripheral Wiring Layout to Prevent Plating Peel
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Solution Overview
Problem
The adhesiveness between the layer to be plated and the metal plating layer in touch sensors formed using a plating method is reduced due to stress, leading to potential peeling of the metal plating layer, which can cause failures in the peripheral wiring.
Innovation Solution
The peripheral wiring in the touch sensor is designed with two or more layers to be plated spaced from each other in the width direction, reducing stress and improving adhesiveness by ensuring a sufficient contact area between the layers and the metal plating layer, thereby preventing peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single layer to be plated is used for peripheral wiring, then the manufacturing process is simple, but the adhesiveness between the layer to be plated and the metal plating layer is reduced due to stress, causing peeling failures
Solution Approach 1:
The peripheral wiring layer to be plated is divided into multiple layers (first layer to be plated and second layer to be plated) stacked in the width direction. This segmentation reduces the stress concentration on a single layer, preventing peeling of the metal plating layer while maintaining manufacturing simplicity through a systematic multi-layer structure.
2Reliability
If multiple layers to be plated are used for peripheral wiring, then the adhesiveness and reliability are improved, but the device complexity increases
Solution Approach 1:
Instead of increasing the complexity in the planar direction, the solution stacks multiple layers to be plated in the width direction (vertical dimension) of the peripheral wiring. This dimensional approach improves adhesiveness and reliability by distributing stress across multiple layers while maintaining a compact structure that does not significantly increase overall device complexity.
3Manufacturing precision
If the line width of peripheral wiring is reduced, then the touch sensor resolution is improved, but the adhesiveness between the layer to be plated and metal plating layer is further reduced due to increased stress
Solution Approach 1:
The peripheral wiring is segmented into multiple thin layers to be plated stacked in the width direction. This allows the overall line width to be reduced for higher resolution while each individual layer maintains sufficient thickness and surface area to support the metal plating layer, preventing peeling failures even in fine-pitch structures.
Solution Approach 2:
The peripheral wiring structure uses a composite approach with multiple layers to be plated (which may have different material compositions) stacked together, creating a composite structure that provides both the mechanical strength needed for adhesiveness and the dimensional precision required for high resolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents the peeling of the metal plating layer, ensuring the reliability and durability of the peripheral wiring in the touch sensor.
Implementation Method 1
a layer to be plated and a metal plating layer covering the layer to be plated
Data Source
AI summary
A touch sensor capable of preventing a failure of a peripheral wiring due to peeling of a metal plating layer. The touch sensor includes a substrate and a conductive layer formed on the substrate, in which the conductive layer has a touch detection electrode, a first electrode pad formed at the touch detection electrode, a peripheral wiring drawn out from the first electrode pad, and a second electrode pad connected to the peripheral wiring. The touch detection electrode, the first electrode pad, the peripheral wiring, and the second electrode pad have a layer to be plated and a metal plating layer covering the layer to be plated. The peripheral wiring includes two or more layers to be plated spaced from each other in a width direction of the peripheral wiring at at least one location.