Touch Structure Conductive Layer Alignment via Inverted Patterning
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Solution Overview
Problem
In the manufacturing of touch structures, particularly capacitive touch structures, there is a challenge in accurately aligning the first and second conductive layer patterns due to the relative thinness of the first functional layer, leading to deviations in the formed patterns, which can result in inconsistent product function and yield.
Innovation Solution
The method involves forming a second conductive layer pattern first, followed by patterning the first conductive layer pattern using the second conductive layer pattern as an alignment mark, and using a photolithography process with appropriate etchants to ensure accurate alignment and differentiation between the two patterns, allowing for precise formation of sensing lines and electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the first conductive layer is patterned first and then the second conductive layer is patterned, then the manufacturing process follows conventional sequence, but alignment deviation occurs due to the thinness of the first functional layer
Solution Approach 1:
The patent inverts the conventional patterning sequence by patterning the second conductive layer first and then patterning the first conductive layer. This reversal allows the thicker second layer to serve as a stable reference for alignment, eliminating the alignment deviation problem that occurs when patterning the thin first layer first.
2Measurement precision
If the first conductive layer is patterned first, then the alignment reference is unavailable, but patterning the second layer first provides an alignment mark
Solution Approach 1:
The patent performs the patterning of the second conductive layer first to create an alignment reference mark before patterning the first conductive layer. This preliminary action ensures that a stable alignment reference is available when patterning the first layer, improving alignment precision without significantly increasing overall process complexity.
3Productivity
If a strong etchant is used to pattern the first conductive layer, then patterning is effective, but the first conductive layer integrity is compromised
Solution Approach 1:
The patent changes the etching parameter by using a weak acid solution instead of a strong etchant. This parameter change allows effective patterning of the first conductive layer while maintaining its integrity, preventing excessive etching damage that would occur with stronger etchants.
Solution Approach 2:
The patent applies different etching strengths to different layers: a weak acid solution is used for the first conductive layer to maintain integrity, while the second conductive layer can withstand stronger etching. This local differentiation of etching quality ensures both patterning effectiveness and layer integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures more accurate alignment of conductive layer patterns, enhancing the sensitivity and functionality of the touch structure, improving production yield and touch sensing capabilities.
Implementation Method 1
the first conductive layer is etched using the first photoresist pattern to form the first conductive layer pattern
Data Source
AI summary
A touch structure and a method of manufacturing the touch structure are provided. The method includes: forming a first conductive layer on a base substrate; forming a second conductive layer on the first conductive layer; and patterning the first conductive layer and the second conductive layer to respectively form a first conductive layer pattern and a second conductive layer pattern; the first conductive layer pattern is formed after the second conductive layer pattern is formed, and the first conductive layer pattern and the second conductive layer pattern are different from each other.