Touch Substrate Bezel Reduction via Metal Stack Wiring
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Solution Overview
Problem
The existing methods for fabricating large-size touch substrates using a splicing exposure process result in increased bezel width due to the formation of thickened mesh patterns, which are invalid for touch control and increase the substrate size.
Innovation Solution
The method involves forming a first electrode layer and a second electrode layer using a splicing exposure process, where metal strips in the edge regions of both layers form a metal stack, and this stack is used to create a wire electrically connected to the metal mesh patterns, thereby eliminating the thickened mesh regions and reducing the bezel width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a splicing exposure process is used to fabricate large-size touch substrates, then the substrate size can be increased, but the bezel width increases due to thickened mesh patterns
Solution Approach 1:
The patent extracts and removes the thickened mesh pattern regions from the electrode structure. By selectively eliminating these invalid touch control regions that cause bezel widening, the invention maintains the splicing exposure process benefits while reducing the bezel width to accommodate larger substrate sizes.
Solution Approach 2:
The patent applies different structural qualities to different regions: the metal mesh patterns maintain their original design for touch control functionality, while the edge regions are modified to prevent thickening. This local differentiation allows large substrates to be fabricated without bezel width increase.
2Length of stationary object
If metal strips are formed in edge regions to create metal stacks, then the bezel width is reduced, but the manufacturing process complexity increases
Solution Approach 1:
The patent merges the metal strip formation with the existing splicing exposure process. The metal strips are created using the same exposure and development steps that form the metal mesh patterns, integrating multiple functions into a unified manufacturing flow rather than adding separate processing stages.
Solution Approach 2:
The splicing exposure process is designed to serve multiple functions simultaneously: it forms the metal mesh patterns for touch control, creates the metal strips in edge regions for bezel reduction, and establishes the overall electrode structure. This multi-functionality reduces the need for additional specialized processing steps.
Data Source
AI summary
The present disclosure relates to a method for fabricating a touch substrate, a touch substrate and a touch device. The method includes: forming, through a splicing exposure process, a first electrode layer including a metal strip in an edge region thereof and a first metal mesh pattern connected with the metal strip; forming, on one side of the first electrode layer and through a splicing exposure process, a second electrode layer including a metal strip in an edge region thereof and a second metal mesh pattern connected with the metal strip and insulated from the first metal mesh pattern, the metal strip of the first electrode layer directly contacting the metal strip of the second electrode layer to form a metal stack; and forming a wire electrically connected with one of the first and metal mesh patterns of the first and second electrode layers by using the metal stack.