Touch Substrate One-Piece Conductive Layer Alignment

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Solution Overview

Problem

Current touch screen manufacturing processes, such as yellow light exposure and roll-to-roll processes, face challenges with alignment issues, increased contact impedance, and high development costs due to the need for multiple masks and different conductive materials in display and wiring areas.

Innovation Solution

A touch substrate design featuring a conductive structure in the peripheral area with a one-piece conductive layer and a wiring structure connecting it to the touch electrode structure, allowing for adjustable wiring without additional masking and eliminating the need for alignment processing, using indium tin oxide or nano silver layers for conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate conductive materials are used in display and wiring areas, then electrical connectivity is achieved, but alignment issues and increased contact impedance occur

Engineering Contradiction:
Improveelectrical connectivityVSAvoidalignment precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent merges the conductive structures in the display area and wiring area into a single integrated conductive layer formed by one patterning process. This eliminates the interface between separate conductive materials, thereby resolving alignment issues and reducing contact impedance while maintaining electrical connectivity.

Inventive Principle:
Principle #5Merging (Combining)

2Manufacturing precision

If multiple masks are used for patterning different areas, then precise pattern formation is achieved, but development costs and process complexity increase

Engineering Contradiction:
Improvepattern formation precisionVSAvoidmask quantity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines the patterning of display area conductive structures and wiring area conductive structures into a single patterning step using one mask. This reduces mask quantity and process complexity while maintaining pattern formation precision through the integrated conductive layer design.

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If wiring positions are adjusted, then design flexibility is improved, but new masking is required increasing development costs

Engineering Contradiction:
Improvewiring position adjustabilityVSAvoiddevelopment cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent forms the complete conductive pattern including both display area and wiring area structures in advance through a single patterning process. This preliminary formation of the integrated conductive layer allows subsequent wiring position adjustments without requiring additional masking, reducing development costs while maintaining design flexibility.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11868557B2Touch substrate and manufacturing method thereof
Publication Date: 2024.01.09 HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD
  • US11868557B2 patent drawing
  • US11868557B2 patent drawing
  • US11868557B2 patent drawing

AI summary

The present disclosure provides a touch substrate and a manufacturing method thereof. The touch substrate includes a base substrate and a touch electrode structure in a display area of the base substrate, and further includes a conductive structure and a wiring structure, wherein the conductive structure is in a peripheral area of the base substrate outside the display area, and includes a one-piece layer which is configured to form a lead electrically connected to a driving circuit for the touch electrode structure; and the wiring structure is in a wiring area between the display area and the peripheral area of the base substrate and is configured to electrically connect the conductive structure to the touch electrode structure. With the touch substrate and the manufacturing method of the touch substrate, problems of poor alignment and lapping, increased contact impedance, insufficient adhesive force and the like can be solved.