Touch Substrate Shared Wiring Reduces Pad Count

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Solution Overview

Problem

Traditional touch substrates require a double-layer printed circuit board with jumper design due to lack of shared connections for driving and receiving channels, increasing cost and complexity.

Innovation Solution

A touch substrate design where first and second touch electrodes are connected via intersecting but insulated wirings, reducing the need for multiple pads and allowing shared connections, implemented through specific layering and patterning of conductive and insulating layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional touch substrate design is used with separate connections for driving and receiving channels, then signal transmission is reliable, but the number of pads and flexible circuit board area increase

Engineering Contradiction:
Improvesignal transmission reliabilityVSAvoidflexible circuit board area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the connections of driving and receiving channels by making the fourth wiring shared between the second touch electrode (receiving channel) and the pad (driving channel connection). This consolidation reduces the total number of separate connections and pads required, thereby decreasing the flexible circuit board area while maintaining signal transmission reliability through proper insulation design.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces an insulating layer as an intermediary between the second wiring and the fourth wiring at their intersection point. This insulating layer acts as a mediator that allows the wirings to cross without electrical connection, preventing short circuits while enabling the shared wiring path that reduces overall circuit board area.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If multiple separate pads are used for driving and receiving channels, then connection reliability is maintained, but manufacturing complexity and cost increase

Engineering Contradiction:
Improveconnection reliabilityVSAvoidpad structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple separate pad connections into a shared fourth wiring structure. Instead of requiring separate pads for each driving and receiving channel connection, the design merges these connections through the shared fourth wiring that connects to a common pad, thereby reducing pad structure complexity and manufacturing steps while maintaining connection reliability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The fourth wiring serves multiple functions: it connects to the second touch electrode for receiving channel signals and simultaneously provides a connection path to the pad for driving channel signals. This multi-functional wiring reduces the number of separate components needed, simplifying the overall device structure and manufacturing process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If wirings are arranged to avoid intersection, then short circuit risk is reduced, but the number of wiring layers and manufacturing steps increase

Engineering Contradiction:
Improveshort circuit preventionVSAvoidwiring manufacturing ease
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent uses an insulating layer as an intermediary substance placed at the intersection of the second wiring and fourth wiring. This insulating layer prevents electrical short circuits between the two wirings while allowing them to cross in the same plane, thereby avoiding the need for additional wiring layers or complex three-dimensional routing that would increase manufacturing difficulty.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS11216125B2Touch substrate and method for manufacturing the same, and display device
Publication Date: 2022.01.04 HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD
  • US11216125B2 patent drawing
  • US11216125B2 patent drawing
  • US11216125B2 patent drawing

AI summary

The embodiments of the present disclosure provide a touch substrate and a method for manufacturing the same, and a display device. The touch substrate includes a substrate, wherein a touch area of the substrate includes first to fourth sides, and a bonding area of the substrate has a fifth side opposite to the fourth side and a sixth side, a first touch electrode and a second touch electrode, a first wiring and a second wiring connected to the first touch electrode via the first side and the second side, respectively, a third wiring and a fourth wiring connected to the second touch electrode via the third side and the fourth side, respectively, and a pad.