Touchpad Assembly With Embedded Coil Haptics and Reduced Thickness
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Solution Overview
Problem
Existing touchpad assemblies face issues of complexity, high cost, and increased thickness due to the integration of force sensors and haptic feedback, which are addressed by reducing the number of components and optimizing the assembly process.
Innovation Solution
A touchpad assembly design featuring a cover plate, touch circuit board, carrying mechanism, magnet group, and vibration isolators, with a single-layer embedded coil layer and magnet group configured to generate vibration acceleration, achieving a reduced thickness of 2.5 mm to 3.5 mm while maintaining effective vibration detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If force sensors and haptic feedback components are integrated into the touchpad assembly, then the functionality is improved, but the device complexity and overall thickness increase
Solution Approach 1:
The patent merges the force sensor and haptic feedback components into a single integrated assembly. The force sensor is mounted directly on the elastic component, which is then integrated with the touch circuit board, eliminating the need for separate mounting structures and reducing overall assembly complexity despite maintaining full functionality.
Solution Approach 2:
The elastic component serves multiple functions simultaneously: it acts as a mounting structure for the force sensor, provides mechanical support, and enables haptic feedback transmission. This multi-functionality reduces the number of separate components needed, thereby reducing assembly complexity while maintaining versatility.
2Adaptability or versatility
If force sensors and haptic feedback components are integrated into the touchpad assembly, then the functionality is improved, but the overall cost increases
Solution Approach 1:
By combining multiple functions into fewer components and simplifying the assembly structure, the patent reduces manufacturing steps and assembly operations. This integration approach lowers manufacturing costs despite maintaining advanced functionality with force sensing and haptic feedback.
3Adaptability or versatility
If force sensors and haptic feedback components are integrated into the touchpad assembly, then the functionality is improved, but the overall thickness increases
Solution Approach 1:
The patent employs thin-film elastic components and flexible mounting structures that provide the necessary mechanical functionality for force sensing and haptic feedback while maintaining minimal thickness. The elastic component acts as a thin flexible element that transmits force and vibration without adding significant thickness to the overall assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a balance between thinning the touchpad assembly and meeting vibration detection requirements, with a maximum press-down deformation of 0.3 mm to 0.7 mm and vibration acceleration of 2G to 15G, using a silicon steel plate to manage thickness and enhance vibration acceleration.
Implementation Method 1
the single-layer embedded coil layer and the magnet group constitute a vibration module
Implementation Method 2
The vibration isolators are disposed between the touch circuit board and the carrying mechanism
Data Source
AI summary
A touchpad assembly comprises a cover plate, a touch circuit board, a carrying mechanism, a magnet group, and vibration isolators. The touch circuit board is disposed under the cover plate and comprises a first touch electrode layer, a second touch electrode layer, and a single-layer embedded coil layer. The carrying mechanism has a central accommodating portion. The magnet group is disposed in the central accommodating portion and constitutes a vibration module with the single-layer embedded coil layer. A pressing gap is formed between the touch circuit board and the magnet group. The vibration isolators are disposed between the touch circuit board and the carrying mechanism.