Touchpad Joint Design for High Display Ratio

The patent moves the driving chip from the non-display side to the display side of the display panel, changing the spatial dimension of component placement. This allows the chip to be directly connected to the touchpad through a joint on the display side, eliminating the need for bent chip on film and touch flexible circuit boards that previously occupied non-display areas, thus increasing the display screen ratio while maintaining electrical connection reliability

The patent creates a joint structure on the display side that replicates the electrical connection function previously achieved through bent circuit boards. This joint serves as a direct connection interface between the touchpad and driving chip, eliminating the need for the traditional bent chip on film structure and its associated non-display areas

The patent applies a strengthening layer with higher hardness specifically in the bonding area where the touchpad connects to the joint. This localized reinforcement maintains the flexibility needed for electrical connection while preventing warping and improving structural integrity. The strengthening layer is strategically placed only where needed, leaving other areas of the touchpad unchanged

The patent creates a composite structure in the bonding area by combining the original bonding layer with a strengthening layer that has higher hardness. This composite structure integrates the electrical connection functionality with enhanced mechanical stability, preventing warping while maintaining connectivity. The combination of materials with different properties achieves both flexibility and structural integrity