Touchpad Module Pressure Sensor Integration
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Solution Overview
Problem
The manufacturing process of conventional touchpads is complex and costly due to the need for assembling pressure sensors on flexible printed circuits, which are prone to damage during transportation and require multiple factory assemblies.
Innovation Solution
A touchpad module design where pressure sensors are directly installed on miniature supporting plates, eliminating the need for flexible printed circuits and simplifying the assembly process, allowing for easier integration with various touchpad sizes and structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pressure sensors are assembled on flexible printed circuits (FPC) in conventional touchpads, then the touchpad can sense pressure, but the manufacturing process becomes complex and costly with multiple factory assemblies required
Solution Approach 1:
The patent merges the pressure sensor and FPC into a single integrated module where the FPC serves dual purposes: as the structural support for the pressure sensor and as the electrical connection medium. This integration eliminates the need for separate assembly steps and reduces the number of components, directly addressing the manufacturing complexity issue while maintaining pressure sensing functionality.
Solution Approach 2:
The pressure sensor is pre-assembled and fixed onto the FPC before the FPC is folded or bent into its final configuration. This preliminary action ensures that the pressure sensor maintains its proper position and electrical connections throughout subsequent manufacturing steps, simplifying the overall process and reducing the need for rework or additional assembly steps at later stages.
2Reliability
If pressure sensors are assembled on flexible printed circuits (FPC) in conventional touchpads, then the touchpad can sense pressure, but the fabricating cost is greatly increased
Solution Approach 1:
The patent merges the pressure sensor and FPC into a single integrated module where the FPC serves dual purposes: as the structural support for the pressure sensor and as the electrical connection medium. This integration eliminates the need for separate assembly steps and reduces the number of components, directly addressing the manufacturing complexity issue while maintaining pressure sensing functionality.
Solution Approach 2:
The patent eliminates the need for separate protective structures or additional components that would normally be required to protect the pressure sensor during assembly and transportation. By integrating the sensor directly onto the FPC, the design recovers the cost that would otherwise be spent on additional protective elements and assembly operations.
3Reliability
If pressure sensors are assembled on flexible printed circuits (FPC) in conventional touchpads, then the touchpad can sense pressure, but the pressure sensor is prone to damage during transportation
Solution Approach 1:
The patent merges the pressure sensor and FPC into a single integrated module where the FPC serves dual purposes: as the structural support for the pressure sensor and as the electrical connection medium. This integration eliminates the need for separate assembly steps and reduces the number of components, directly addressing the manufacturing complexity issue while maintaining pressure sensing functionality.
Solution Approach 2:
The FPC is designed with inherent flexibility and cushioning properties that protect the pressure sensor during transportation and handling. The flexible nature of the FPC absorbs shocks and mechanical stresses, preventing damage to the pressure sensor without requiring additional protective packaging or structures.
4Reliability
If pressure sensors are assembled on flexible printed circuits (FPC) in conventional touchpads, then the touchpad can sense pressure, but the overall fabricating process is complicated requiring multiple factory assemblies
Solution Approach 1:
The patent merges the pressure sensor and FPC into a single integrated module where the FPC serves dual purposes: as the structural support for the pressure sensor and as the electrical connection medium. This integration eliminates the need for separate assembly steps and reduces the number of components, directly addressing the manufacturing complexity issue while maintaining pressure sensing functionality.
Solution Approach 2:
The pressure sensor is pre-assembled and fixed onto the FPC before the FPC is folded or bent into its final configuration. This preliminary action ensures that the pressure sensor maintains its proper position and electrical connections throughout subsequent manufacturing steps, simplifying the overall process and reducing the need for rework or additional assembly steps at later stages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing process, reduces costs, and enhances the reliability of touchpad assembly by eliminating the risk of pressure sensor damage during transportation, while enabling flexible application to different touchpad module configurations.
Implementation Method 1
Each of the at least one pressure sensing module includes a pressure sensor and a miniature supporting plate. The pressure sensor is installed on the miniature supporting plate. The pressure sensor is electrically connected with the touch sensitive circuit board through the miniature supporting plate. While the touch member is pressed in response to an external pressing force, the pressing force exerted on the touch member is sensed by the at least one pressure sensing module, and the at least one pressure sensing module generates a pressure sensing signal.
Data Source
AI summary
A touchpad module includes a base plate, a touch member and at least one pressure sensing module. The touch member is located over the base plate. The touch member includes a touch plate and a touch sensitive circuit board. The pressure sensing module is arranged between the base plate and the touch member. The pressure sensing module includes a pressure sensor and a miniature supporting plate. The pressure sensor is installed on the miniature supporting plate. The pressure sensor is electrically connected with the touch sensitive circuit board through the miniature supporting plate. While the touch member is pressed in response to an external pressing force, the pressing force exerted on the touch member is sensed by the at least one pressure sensing module, and the pressure sensing module generates a pressure sensing signal.


