Touchpad Assembly With Slotted Adhesive Layer for Vertical Haptics
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Solution Overview
Problem
Existing touchpad devices face issues of complexity, high cost, and increased thickness due to the integration of force sensors and haptic feedback, primarily because of numerous components and complex assembly processes.
Innovation Solution
A touchpad device design featuring a cover plate with closed slots on an adhesive layer, elastic members supporting the assembly, and a circuit board with a touch sensing member and coil layer, which compensates for detection capacitance differences and enhances vertical vibration haptics by magnetic pole structures and signal processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If force sensors and haptic feedback are integrated into touchpad devices, then functional performance is improved, but device complexity increases
Solution Approach 1:
The patent combines the adhesive layer and elastic members into a single integrated component. The adhesive layer serves dual functions: bonding the cover plate to the circuit board and providing elastic deformation for haptic feedback. This merging eliminates the need for separate force sensors and haptic feedback mechanisms, reducing device complexity while maintaining functional performance.
Solution Approach 2:
The adhesive layer is designed to perform multiple functions simultaneously: structural bonding, elastic deformation for haptic feedback, and vibration response. By making the adhesive layer multi-functional, the patent eliminates the need for dedicated force sensors and haptic feedback components, thereby reducing device complexity while preserving adaptability and versatility.
2Adaptability or versatility
If multiple components are used for force sensing and haptic feedback, then functional performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the adhesive layer and elastic members into one component, reducing the total number of parts that need to be manufactured and assembled. This integration lowers manufacturing costs by eliminating separate production processes for force sensors and haptic feedback components while maintaining the required functional performance.
Solution Approach 2:
The multi-functional adhesive layer replaces multiple specialized components, reducing material costs and assembly expenses. By designing the adhesive layer to provide both bonding and haptic feedback functions, the patent achieves cost efficiency without sacrificing functional performance.
3Adaptability or versatility
If force sensors and elastic components are installed separately, then functional performance is improved, but assembly complexity increases
Solution Approach 1:
The patent combines the adhesive layer and elastic members into a single pre-assembled component that is installed as one unit. This merging eliminates the need for separate assembly steps for force sensors and elastic components, significantly reducing assembly complexity while maintaining functional performance.
4Adaptability or versatility
If closed slots are added to the adhesive layer, then haptic feedback performance is improved, but adhesive strength may be reduced
Solution Approach 1:
The patent applies local quality by creating closed slots only in specific regions of the adhesive layer where haptic feedback is needed, while maintaining solid adhesive structure in bonding-critical areas. This localized modification optimizes haptic feedback performance without compromising overall adhesive strength.
Solution Approach 2:
The patent modifies the adhesive layer's physical structure by introducing closed slots with specific geometric parameters (size, distribution, shape). These parameter changes enable the adhesive layer to deform elastically for haptic feedback while maintaining sufficient bonding strength through optimized slot design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves vertical vibration haptics, ensures firm adhesive attachment, prevents adhesive deformation, and optimizes circuit board area utilization while reducing assembly complexity and cost.
Implementation Method 1
a plurality of elastic members 230. The elastic members 230 are disposed between the first assembly 210 and the second assembly 220
Implementation Method 2
The circuit board 213 is disposed under the adhesive layer 212 and comprises a touch sensing member 213a... configured to compensate for differences in detection capacitance signals
Implementation Method 3
The circuit board 213 is disposed under the adhesive layer 212 and comprises a touch sensing member 213a and a coil layer 213b... The second assembly 220 comprises a supporting member 221 and a magnet set 222
Data Source
AI summary
A touchpad device includes a first assembly, a second assembly, and a plurality of elastic members. The first assembly includes a cover plate, an adhesive layer, and a circuit board. The cover plate has a bonding area and a non-bonding area. The adhesive layer is disposed under the cover plate and has a plurality of closed slots corresponding to the non-bonding area. The adhesive layer has a thickness of about 50 μm to about 500 μm. The circuit board is disposed under the adhesive layer and includes a touch sensing member and a coil layer. The second assembly includes a supporting member and a magnet set disposed on the supporting member. The elastic members are disposed between the first assembly and the second assembly and correspond to the closed slots in an arrangement direction of the cover plate and the adhesive layer.